Reactive Molecular Dynamics Simulation on Bulk and Shear Modulus of Polyimide-POSS Composites at Low Temperature

机译：低温聚酰亚胺复合材料体和剪切模量的反应性分子动力学模拟

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Few studies have focused on effect of nanoparticles on mechanical properties of PI film at low temperature. In this paper, one king of POSS namely polyphenylsilsesquioxane (PPSQ) was added to PI molecules, and the mechanical property of PI-POSS composites were studied by molecular dynamics. The variation of bulk modulus and shear modulus of the composites at low temperature was analyzed. Bulk modulus and shear modulus of Polyimide-POSS composite model would decrease as the temperature rose. Compared with the pristine PI model, the bulk and shear modulus of composite model was smaller.

机译：少数研究侧重于纳米颗粒对低温下Pi膜力学性能的影响。在本文中，向PI分子中加入了一个母亲即多苯基钠喹甲烷（PPSQ），通过分子动力学研究了PI-POSS复合材料的力学性能。分析了在低温下复合材料的体积模量和剪切模量的变化。随着温度升高，聚酰亚胺 - 足数复合模型的体积和剪切模量将减少。与原始PI模型相比，复合模型的体积和剪切模量较小。

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《International Conference on Applied Superconductivity and Electromagnetic Devices》|2020年|1-2|共2页
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Jianmei Cao; Yunqi Xing; Jiwei Zhang; Haoren Jiang; Jiangqiao Long; Yuanxiang Wu; Bingqiang Wang;
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Temperature; Mechanical factors; Nanoparticles; Stress; Simulated annealing; Thermal stability; Temperature control;

机译：温度;机械因子;纳米粒子;应力;模拟退火;热稳定性;温度控制;

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Reactive Molecular Dynamics Simulation on Bulk and Shear Modulus of Polyimide-POSS Composites at Low Temperature

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