This paper describes a single-step method for assembling and encapsulating a microbubble chamber in which injection-molded plastic secures the fluidic and electrical interconnects. All of the necessary components for the chamber are loose assembled in a plastic-injection mold and subsequently packaged, encapsulated, and sealed in one molding step. These components include a silicon/Pyrex~® bubble chamber, copper electrical leads, and small-gauge stainless steel fluidic headers. This approach delivers a fully integrated microbubble chamber with 1) zero dead volume, 2) low electrical contact resistance ( < 1 Ohm), 3) low compliance, in-plane fluid interconnects and 4) small overall dimensions (7.5 mm x 4 mm x 3 mm) conforming to the Dual In-Line Package (DIP) standard, Fig 1.
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机译：本文介绍了一种用于组装和封装微泡腔的单步方法，其中，注塑塑料可固定流体和电气互连。将腔室的所有必需组件松散地组装在注塑模具中，然后在一个成型步骤中进行包装，封装和密封。这些组件包括一个硅/Pyrex®气泡室，铜导线和小规格的不锈钢流体集管。这种方法提供了一个完全集成的微气泡腔，该腔具有1）零死体积，2）低电接触电阻（<1 Ohm），3）低柔顺性，平面内流体互连以及4）较小的整体尺寸（7.5 mm x 4 mm x 3 mm）符合双列直插式封装（DIP）标准，图1。
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