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Design and System-Level Simulation of a Novel On-Chip Test Based on Macromodels

机译:基于宏模型的新型在线测试的设计和系统级仿真

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摘要

The methods of on-chip integrated testing have a wide application with the development of the study for MEMS materials properties measurement in microscale. A novel on-chip integrated micro-tensile testing system is designed through system-level simulation based on macromodels to measure the fracture strength and fatigue mechanical properties of polysilicon thin films. The structure of testing instrument consists of V-beam electrothermal actuator, differential capacitance sensor, supporting spring and specimen. The capacitance signal is sensed and controlled by a second sigma-delta modulator circuit. The analytic macromodel of polysilicon thin film specimen considering geometric nonlinearity and the numerical reduced-order model of V-beam electrothermal actuator based on Krylov subspace projection are created separately and described in the MAST hardware language. The mechanical structure dimension size and circuit components parameters are determined and optimized according to system-level simulation. The computing result has shown that the self-build macromodels and the on-chip integrated test system are efficient and reliable.
机译:随着微尺度MEMS材料性能测量研究的发展,片上集成测试方法得到了广泛的应用。通过基于宏观模型的系统级仿真,设计了一种新颖的片上集成微拉伸测试系统,以测量多晶硅薄膜的断裂强度和疲劳力学性能。测试仪器的结构由V型束电热执行器,差动电容传感器,支撑弹簧和试样组成。电容信号由第二个sigma-delta调制器电路感测和控制。分别创建了考虑几何非线性的多晶硅薄膜样品解析宏模型和基于Krylov子空间投影的V型束电热致动器的数值降阶模型,并以MAST硬件语言进行了描述。根据系统级仿真确定并优化机械结构尺寸大小和电路组件参数。计算结果表明,自建宏模型和片上集成测试系统是高效可靠的。

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