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THE EXPERIMENTAL INVESTIGATION OF FAILURE MODE IN THREE-LAYERED SPECIMEN

机译:三层标本失效模式的实验研究

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摘要

Microelectronic packaging becomes more and more important in the field of electronic industry which is the basis of one modern nation's development. The parameter mismatches in the areas of electronics and mechanics are the main factors for the failure of the packaging system. In this paper, the possibility of mechanical failure is examined The structure of the packaging system is multi-layered, so the interface is the focus of the research work. Because of a crack or void existing on the interface, the phenomena of debonding, spalling and buckling occur and cause the failure of the whole system.rnConsidering the practical case, double cantilever beam (DCB) specimen is selected in the test, two main case are tested: an epoxy layer is sandwiched between two Al_2O_3 adherends; a copper layer is sandwiched between two Al_2O_3 adherends.
机译:在一个现代国家发展的基础上,微电子包装在电子工业领域变得越来越重要。电子和机械领域的参数不匹配是包装系统故障的主要因素。本文研究了机械故障的可能性。包装系统的结构是多层的,因此接口是研究工作的重点。由于界面上存在裂纹或空隙,会发生剥离,剥落和屈曲现象,并导致整个系统的故障。rn考虑到实际情况,本试验中选择了双悬臂梁(DCB)试样,主要有两种情况测试:在两个Al_2O_3被粘物之间夹有环氧树脂层;铜层夹在两个Al_2O_3被粘物之间。

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