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ADVANCED BARE-DIE PACKAGING TECHNOLOGY FOR FLAT PANEL DISPLAYS

机译：平板显示器先进的裸片包装技术

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Packaging technology for FPD (flat panel display) drivers has evolved from TAB (tape automated bonding) to COG (chip-on-glass) for size, cost, and performance reasons. COG supports demands for increased display sizes, pixel counts, and gray levels, as well as for reduced power consumption. It is also considered the most promising candidate for next-generation LCD packaging because the reduction in bonding steps lowers cost and increases reliability.rnCOG packaging bonds bare IC driver chips directly to the panel electrodes, thus reducing materials requirements and production costs. The current advanced COG mounting technology for LCD (liquid crystal display) panels includes the pressure welding method, the conductive paste method, the conductive elastic particles method, and the anisotropic conductive adhesives (ACAs) method. Nowadays, two variants of the conductive paste method are in commercial use. The most common approach uses a Pd-Ag paste, which reportedly provides a bonding resistance of less than 5 Ω/electrode and a bond strength of 20 g/electrode. Heating the paste to approximately 150℃ reduces its adhesive strength enough to allow the drivers to be removed and rebonded. The second commercial method uses bumps that are not plated but formed with a two-stage ball-bonding technique. This process covers the Cu/Au stud-bump with a conductive paste and uses a zigzag formation that improves connection efficiency and allows a bond pitch of 7 μm. In contrast to the approach using Pd-Ag paste, this technique typically uses silicon instead of epoxy for encapsulation.
机译：由于尺寸，成本和性能方面的原因，FPD（平板显示器）驱动器的封装技术已从TAB（卷带式自动粘合）发展为COG（玻璃上芯片）。 COG支持增加显示尺寸，像素数和灰度级以及降低功耗的需求。它也被认为是下一代LCD封装最有希望的候选者，因为减少了键合步骤可降低成本并提高可靠性。rnCOG封装可将裸露的IC驱动器芯片直接粘合到面板电极上，从而降低了材料要求和生产成本。当前用于LCD（液晶显示）面板的先进COG安装技术包括压力焊接法，导电胶法，导电弹性颗粒法和各向异性导电胶（ACA）法。如今，导电浆料方法的两种变体已经投入商业使用。最常见的方法是使用Pd-Ag浆料，据报道该浆料提供的粘合电阻小于5Ω/电极，粘合强度为20 g /电极。将糊料加热到大约150℃会降低其粘合强度，足以去除并重新粘合驱动剂。第二种商业方法使用未电镀但通过两阶段球焊技术形成的凸块。此过程使用导电胶覆盖Cu / Au柱形凸块，并使用之字形结构来提高连接效率并允许键距为7μm。与使用Pd-Ag浆料的方法相比，该技术通常使用硅代替环氧树脂进行封装。

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