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Evaluation of Low Cost Metallization Process for Power Electronic Modules by Wire Wedge Bond Process on Nickel/Copper and Nickel/Copper/Silver Pads

机译：镍/铜和镍/铜/银焊盘上的引线楔焊工艺对电力电子模块低成本金属化工艺的评估

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Wire-bonding is the dominant method used for chip interconnections and it is very important to the development and manufacturing of power electronic modules. It has been used in microelectronic packaging for years using aluminum or gold wire. In this work, a low cost process using wire wedge bond on nickel/copper and nickel/copper/silver metal stack are presented. Rupture tests were performed in order to investigate the mechanical reliability of the metal layer for wire bonding application.

机译：引线键合是芯片互连的主要方法，对于功率电子模块的开发和制造非常重要。多年来，它已使用铝线或金线用于微电子包装。在这项工作中，提出了一种在镍/铜和镍/铜/银金属叠层上使用楔形焊的低成本工艺。进行破裂试验以研究用于引线键合应用的金属层的机械可靠性。

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来源
《Microelectronics technology and devices - SBMicro 2011》|2011年|p.385-392|共8页
会议地点 Joao Pessoa(BR);Joao Pessoa(BR)
作者
C. Biasotto; L. B. Isoda; C. S. C. S. Franco; N. Armigliato;
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作者单位

SEMIKRON Semicondutores Ltda. Av. Inocencio Serafico, 6300, CEP 06366-900 - Carapicuiba - Sao Paulo;

SEMIKRON Semicondutores Ltda. Av. Inocencio Serafico, 6300, CEP 06366-900 - Carapicuiba - Sao Paulo;

SEMIKRON Semicondutores Ltda. Av. Inocencio Serafico, 6300, CEP 06366-900 - Carapicuiba - Sao Paulo;

SEMIKRON Semicondutores Ltda. Av. Inocencio Serafico, 6300, CEP 06366-900 - Carapicuiba - Sao Paulo;

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正文语种 eng
中图分类半导体技术;
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1. Bondability of Second Copper Wire Bonds on Silver and Nickel-Palladium–Gold-Silver Metallization [J] . Ismail Roslina, Harun Fuaida, Zulkifli Muhammad Nubli, Components, Packaging and Manufacturing Technology, IEEE Transactions on . 2015,第10期

机译：银和镍钯-金-银金属镀层上的第二铜线键合的可焊性
2. Modern Environmental Problems of Metallurgical Plants Processing Copper, Copper-nickel and Nickel Raw Materials [J] . Yu. A. Karasev, G. A. Velyuzhinets, A. V. Severilov Non-Ferrous Metals . 2010,第1期

机译：冶金厂加工铜，铜镍和镍原料的现代环境问题
3. Comparison of Gold and Copper Wire Bonding on Aluminum and Nickel-Palladium-Gold Bond Pads for Automotive Application [J] . Tu Anh Tran, Varughese Mathew, Harold Downey Journal of Microelectronics and Electronic Packaging . 2012,第2期

机译：汽车应用铝和镍-钯-金键合焊盘上金铜键合的比较
4. Evaluation of Low Cost Metallization Process for Power Electronic Modules by Wire Wedge Bond Process on Nickel/Copper and Nickel/Copper/Silver Pads [C] . C. Biasotto, L. B. Isoda, C. S. C. S. Franco, Symposium on Microelectronics Technology and Devices . 2011

机译：镍/铜和镍/铜/银焊盘电线楔形电力电气模块低成本金属化工艺评价
5. (Copper, nickel) tin intermetallic formation kinetics on electroless nickel when varying copper concentration and reflow process. [D] . Anselm, Martin K. 2011

机译：当改变铜浓度和回流工艺时，化学铜上的（铜，镍）锡金属间化合物形成动力学。
6. Cost-Effective Copper–Nickel-Based Triboelectric Nanogenerator for Corrosion-Resistant and High-Output Self-Powered Wearable Electronic Systems [O] . Kequan Xia, Zhiwei Xu, Zhiyuan Zhu, 2019

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7. 3D-FE electro-thermo-magnetic modeling of automotive power electronic modules - Wire-bonding and Copper clip technologies comparison [O] . THIAM Abdoulahad, SARRAUTE Emmanuel, SANFINS William, 2019

机译：汽车电力电子模块的3D-FE电热 - 热磁模型 - 引线键合和铜夹技术比较
8. An Investigation of the Change in the Electrical and Mechanical Properties of a Bimetal Copper-Nickel Wire in the Process of Its Manufacture and Prolonged Heat Treatment [R] . Shpichinetskii, E. S., Emelyanov, Y. A. 1969

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Evaluation of Low Cost Metallization Process for Power Electronic Modules by Wire Wedge Bond Process on Nickel/Copper and Nickel/Copper/Silver Pads

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