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Mechanical modeling of Thin Films Bonded to Functionally Graded Materials

机译：粘结到功能梯度材料上的薄膜的机械建模

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In this study the contact problems of thin films bonded to Functionally Graded Materials (FGM) are considered. In these problems the loading consists of any one or combination of stresses caused by uniform temperature changes and temperature excursions, far field mechanical loading, and residual stresses resulting from film processing or in the manufacturing process of the graded coating. The primary interest in this study is in examining stress concentrations or singularities near the film ends for the purpose of addressing the question of crack initiation and propagation in the substrate or along the interface. The underlying contact mechanics problem is formulated by assuming that the film is a "membrane" and the FGM an elastic continuum, and is solved analytically by reducing it to an integral equation. The calculated results are the interfacial shear stress between the film and the graded substrate, mode II stress intensity factor at the end of the film and the axial normal stress in the film.
机译：在这项研究中，考虑了粘结到功能梯度材料（FGM）上的薄膜的接触问题。在这些问题中，载荷包括由均匀的温度变化和温度偏移，远场机械载荷以及膜加工或渐变涂层的制造过程中产生的残余应力引起的任何一种应力或应力的组合。这项研究的主要目的是检查膜端附近的应力集中或奇异点，以解决裂纹在基底或沿界面的萌生和扩展的问题。通过假设膜是“膜”而FGM是弹性连续体来表达潜在的接触力学问题，并通过将其简化为积分方程来解决。计算结果是薄膜与渐变基材之间的界面剪切应力，薄膜末端的II型应力强度因子和薄膜中的轴向法向应力。

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