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Adaptive composite materials with novel architectures

机译：具有新颖架构的自适应复合材料

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Today, there is a strong push to improve the thermal management of electronic components in order to increase the performance and the reliability of electronic devices. Up to now, most of the heat sinks are mainly made of Copper that presents a good thermal conductivity (TC) but a coefficient of thermal expansion (CTE) much higher than the ceramic of the DBC (direct bonding Copper). It induces interfacial thermal stresses and indeed it decreases the reliability of the global electronic system. Therefore, there is a strong need for the development of novel heat dissipation material having low CTE combined with high TC. Carbon fibres reinforced copper matrix offers a good compromise between thermo mechanical properties (i.e. CTE) and medium TC. In order to increase surface TC, pure Copper can be added on the top surface and/or on the bottom one of the composite heat sink playing the role of heat spreader for hot spots linked with the Si components. The fabrication technique of these materials is based on powder metallurgy technique. The thermal properties of adaptive materials, TC and CTE, have been measured for different Copper thicknesses and architectures ([C/Cu], [Cu - C/Cu] and [Cu - C/Cu - Cu]). Simulation of the TC and CTE have been performed and compared to the experimental results.
机译：如今，为了提高电子设备的性能和可靠性，人们大力推动改善电子部件的热管理。到目前为止，大多数散热器主要由铜制成，具有良好的导热性（TC），但热膨胀系数（CTE）远高于DBC（直接键合铜）的陶瓷。它会引起界面热应力，实际上会降低整体电子系统的可靠性。因此，迫切需要开发具有低CTE和高TC的新型散热材料。碳纤维增强的铜基体在热机械性能（即CTE）和中等TC之间有很好的折衷。为了增加表面TC，可以在复合散热器的顶表面和/或底部添加纯铜，以起到与Si成分相连的热点的散热器的作用。这些材料的制造技术基于粉末冶金技术。已经针对不同的铜厚度和结构（[C / Cu]，[Cu-C / Cu]和[Cu-C / Cu-Cu]）测量了自适应材料TC和CTE的热性能。进行了TC和CTE的仿真，并与实验结果进行了比较。

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