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Vibrating RF MEMS for Low Power Communications

机译:用于低功耗通信的振动RF MEMS

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摘要

Micromechanical communication circuits fabricated via IC-compatible MEMS technologies and capable of low-loss filtering, mixing, switching, and frequency generation, are described with the intent to miniaturize wireless transceivers. Possible transceiver front-end architectures are then presented that use these micromechanical circuits in large quantities to substantially reduce power consumption. Technologies that integrate MEMS and transistor circuits into single-chip systems are then reviewed with an eye towards the possibility of single-chip communication transceivers.
机译:为了使无线收发器小型化,描述了通过IC兼容的MEMS技术制造的,能够进行低损耗滤波,混合,切换和频率生成的微机械通信电路。然后介绍了可能的收发器前端架构,这些架构大量使用了这些微机械电路,从而大大降低了功耗。然后,针对将MEMS和晶体管电路集成到单芯片系统中的技术进行了研究,着眼于单芯片通信收发器的可能性。

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