A wet chemistry approach to sub-micron, removable flip chip interconnects

著录项

• 来源
  《Nanoengineering: Fabrication, properties, optics and devices V》|2008年|70390R.1-70390R.11|共11页
• 会议地点 San Diego CA(US)
• 作者

  Chirstopher J. Orendorff; Joy M. Barker; Adam M. Rowen; W. Graham Yelton; Christian L. Arrington; J. Rusty Gillen;

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• 作者单位

  Advanced Power Sources Research and Development Department Sandia National Laboratories, PO Box 5800, Albuquerque, NM, USA 87185-0614;

  Department of Sensors and Analogue Electronics Sandia National Laboratories, PO Box 5800, Albuquerque, NM, USA 87185-0614;

  Department of Photonic Microsystems Technology Sandia National Laboratories, PO Box 5800, Albuquerque, NM, USA 87185-0614;

  Department of Photonic Microsystems Technology Sandia National Laboratories, PO Box 5800, Albuquerque, NM, USA 87185-0614;

  Department of Photonic Microsystems Technology Sandia National Laboratories, PO Box 5800, Albuquerque, NM, USA 87185-0614;

  Department of Photonic Microsystems Technology Sandia National Laboratories, PO Box 5800, Albuquerque, NM, USA 87185-0614;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 特种结构材料;
• 关键词

  nanosphere lithography; flip chip; 3D stacking; bump bond; electroplating; electrodeposition;

  机译：纳米球光刻；倒装芯片3D堆叠；凹凸结合电镀;电沉积;