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Silicon Photonic Integrated Circuits: From Devices to Integration

机译：硅光子集成电路：从设备到集成

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摘要

Silicon Photonics taps on the volume manufacturing capability of traditional silicon manufacturing techniques, to provide dramatic cost reduction for various application domains employing optical communications technology. In addition, an important new application domain would be the implementation of high bandwidth optical interconnects in and around CPUs. Besides volume manufacturability, Silicon Photonics also allows the monolithic integration of multiple optical components on the same wafer to realize highly compact photonic integrated circuits (PICs), in which functional complexity can be increased for little additional cost. An important pre-requisite for Si PICs is a device library in which the devices are compatibly developed around a common SOI platform. A device library comprising passive and active components was built, which includes light guiding components, wavelength-division-multiplexing (WDM) components, switches, carrier-based Si modulators and electro-absorption based Ge/Si modulators, Ge/Si photodiodes and avalanche photodiodes, as well as light emitting devices. By integrating various library devices, PIC test vehicles such as monolithic PON transceivers and DWDM receivers have been demonstrated. A challenge with Si PICs lies with the coupling of light into and out of the sub-micrometer Si waveguides. The mode size mismatch of optical fibers and Si waveguides was addressed by developing a monolithically integrated multi-stage mode converter which offers low loss together with relaxed fiber-to-waveguide alignment tolerances. An active assembly platform using MEMS technology was also developed to actively align and focus light from bonded lasers into waveguides.
机译：Silicon Photonics充分利用了传统硅制造技术的批量生产能力，从而为采用光通信技术的各种应用领域大幅降低了成本。此外，一个重要的新应用领域将是在CPU内部及其周围实现高带宽光学互连。除了体积可制造性之外，Silicon Photonics还允许将多个光学组件单片集成在同一晶片上，以实现高度紧凑的光子集成电路（PIC），其中功能复杂性可以提高，而所需成本却很少。 Si PIC的重要先决条件是设备库，在其中可以围绕通用SOI平台兼容地开发设备。建立了包括无源和有源组件的设备库，其中包括光导组件，波分复用（WDM）组件，开关，基于载波的Si调制器和基于电吸收的Ge / Si调制器，Ge / Si光电二极管和雪崩光电二极管以及发光器件。通过集成各种库设备，已经演示了PIC测试工具，例如单片PON收发器和DWDM接收器。 Si PIC的挑战在于将光耦合到亚微米Si波导中和从中传出。通过开发单片集成的多级模式转换器，可以解决光纤和Si波导的模式尺寸不匹配问题，该转换器具有低损耗以及宽松的光纤到波导对准公差。还开发了使用MEMS技术的有源组装平台，以将来自结合激光器的光主动对准并聚焦到波导中。

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  • 来源
    《Optoelectronic integrated circuits XIII》|2011年|p.79420E.1-79420E.10|共10页
  • 会议地点 San Francisco CA(US)
  • 作者

    Tsung-Yang Liow; Qing Fang; Andy Eu-Jin Lim; Liang Ding; Qing Xin Zhang; Jing Zhang; Ning Duan; Junfeng Song; Fang-Fang Ren; Hong Cai; Samson Tua Halomoan Silalahi;

  • 作者单位

    Mingbin Yu, Guo-Qiang Lo, and Dim-Lee Kwong A~* STAR Institute of Microelectronics, 11 Science Park Road, Singapore 117685;

    Mingbin Yu, Guo-Qiang Lo, and Dim-Lee Kwong A~* STAR Institute of Microelectronics, 11 Science Park Road, Singapore 117685;

    Mingbin Yu, Guo-Qiang Lo, and Dim-Lee Kwong A~* STAR Institute of Microelectronics, 11 Science Park Road, Singapore 117685;

    Mingbin Yu, Guo-Qiang Lo, and Dim-Lee Kwong A~* STAR Institute of Microelectronics, 11 Science Park Road, Singapore 117685;

    Mingbin Yu, Guo-Qiang Lo, and Dim-Lee Kwong A~* STAR Institute of Microelectronics, 11 Science Park Road, Singapore 117685;

    Mingbin Yu, Guo-Qiang Lo, and Dim-Lee Kwong A~* STAR Institute of Microelectronics, 11 Science Park Road, Singapore 117685;

    Mingbin Yu, Guo-Qiang Lo, and Dim-Lee Kwong A~* STAR Institute of Microelectronics, 11 Science Park Road, Singapore 117685;

    Mingbin Yu, Guo-Qiang Lo, and Dim-Lee Kwong A~* STAR Institute of Microelectronics, 11 Science Park Road, Singapore 117685;

    Mingbin Yu, Guo-Qiang Lo, and Dim-Lee Kwong A~* STAR Institute of Microelectronics, 11 Science Park Road, Singapore 117685;

    Mingbin Yu, Guo-Qiang Lo, and Dim-Lee Kwong A~* STAR Institute of Microelectronics, 11 Science Park Road, Singapore 117685;

    Mingbin Yu, Guo-Qiang Lo, and Dim-Lee Kwong A~* STAR Institute of Microelectronics, 11 Science Park Road, Singapore 117685;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 光学集成电路（集成光路）;
  • 关键词

    silicon photonics; silicon photonic integrated circuits; monolithic integration; germanium photodiode; silicon modulator; electro-absorption modulator; silicon wdm; mems active assembly.;

    机译：硅光子学硅光子集成电路；单片集成锗光电二极管硅调制器电吸收调制器硅wdm;内存主动装配。;

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