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首页> 外文会议>Pacific Rim International Conference on Advanced Materials and Processing(PRICM 5) pt.1; 20041102-05; Beijing(CN) >Phase transition during slow heating in the mixture insert metal using TLP bonded interlayer
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Phase transition during slow heating in the mixture insert metal using TLP bonded interlayer

机译：使用TLP键合夹层在混合物插入金属中缓慢加热时的相变

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摘要

This study was carried out to investigate the effect of heating rate on the phase transition between additive base metal powder and liquid insert metal during transient liquid phase (TLP) diffusion bonding of Ni-based superalloy GTD-111. Heating rates studied were 10,1,0.5 and 0.1℃ s~(-1) in high vacuum conditions (3 x 10~(-5) torr) by means of a high frequency induction furnace. When heated at lower than 0.5℃ s~(-1), the transition of dissolution to solidification occurred during heating. In the case of very slow heating, the dissolution quickly finished at a lower temperature, and solidification soon started. The separated grains of additive base metal powders supplied the lager interface area for the diffusion of boron. Solidification transition temperatures of liquid phase were affected by the increase of diffusion interface and of duration time during slow heating. A minimum heating rate required to heat insert materials to a normal TLP isothermal bonding temperature of GTD-111 (≈ 1150℃) without a dissolution-solidification transition during heating should be higher than 1 ℃ s~(-1).
机译：本研究旨在研究镍基高温合金GTD-111在过渡液相（TLP）扩散键合过程中升温速率对添加剂基体金属粉末与液相插入金属之间相变的影响。在高真空条件下（3 x 10〜（-5）托），通过高频感应炉研究了加热速率分别为10、1、0.5和0.1℃s〜（-1）。在低于0.5℃s〜（-1）加热时，加热过程中发生了溶解向凝固的转变。在非常缓慢的加热的情况下，溶解在较低的温度下迅速完成，并且固化很快开始。添加剂贱金属粉末的分离颗粒为硼的扩散提供了更大的界面区域。液相的凝固转变温度受慢速加热过程中扩散界面和持续时间的增加的影响。将插入的材料加热到GTD-111的正常TLP等温粘合温度（≈1150℃）而在加热过程中不发生溶解-凝固转变的最低加热速率应高于1℃s〜（-1）。

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