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New Hybrid Large DIPIPMTM for PV Application with built-in SiC-SBD and seventh-generation CSTBT~™

机译:内置SiC-SBD和第七代CSTBT〜™的用于光伏应用的新型Hybrid Large DIPIPMTM

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摘要

A new transfer mold type hybrid Silicon Carbide (SiC) large DIPIPM~(TM) developed forrnphotovoltaic (PV) power generating application is presented in this paper. The new DIPIPM~(TM)rnis designed with built-in SiC Schottky Barrier Diode (SBD) and seventh-generation CSTBT~(TM)rnchip that helped to achieve about 25% power loss reduction compare with MitsubishirnElectric’s existing PV DIPIPM~(TM).
机译:提出了一种新型的传递模具式混合碳化硅(SiC)大型DIPIPM〜(TM)开发的光伏发电应用。与MitsubishirnElectric现有的PV DIPIPM〜(TM)相比,采用内置SiC肖特基势垒二极管(SBD)和第七代CSTBT〜(TM)芯片设计的新型DIPIPM〜TM rnis有助于将功耗降低约25%。 。

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