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An Accurate Thermal Resistance Testing Method for Power Semiconductors

机译:功率半导体的精确热阻测试方法

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摘要

In this paper, the effect of temperature nonlinearities of the packaging materials on thernthermal resistance measurement was analyzed by FEM tools. Based on the simulationrnresults, a novel thermal resistance testing method for power semiconductors was proposedrnto improve the accuracy compared to the published JESD51-14 standard. Experimentalrnresults verified the effectiveness of the proposed method.
机译:本文通过有限元工具分析了包装材料温度非线性对热阻测量的影响。基于仿真结果,提出了一种新型的功率半导体热阻测试方法,以提高与公布的JESD51-14标准相比的精度。实验结果验证了该方法的有效性。

著录项

  • 来源
  • 会议地点 Shanghai(CN)
  • 作者

    Jin Zhang; Zhijie Qiu; Xuhui Wen;

  • 作者单位

    Institute of Electrical Engineering, Chinese Academy of Sciences, China,Key Laboratory of Power Electronics and Electric Drive, Chinese Academy of Sciences,China,Beijing Engineering Laboratory of Electrical Drive System Power Electronic DevicePackaging Technology, China,ejzhang@mail.iee.ac.cn;

    Institute of Electrical Engineering, Chinese Academy of Sciences, China,Key Laboratory of Power Electronics and Electric Drive, Chinese Academy of Sciences,China,Beijing Engineering Laboratory of Electrical Drive System Power Electronic DevicePackaging Technology, China;

    Institute of Electrical Engineering, Chinese Academy of Sciences, China,Key Laboratory of Power Electronics and Electric Drive, Chinese Academy of Sciences,China,Beijing Engineering Laboratory of Electrical Drive System Power Electronic DevicePackaging Technology, China;

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  • 原文格式 PDF
  • 正文语种 eng
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