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首页> 外文会议>Proceedings of the 1999 ASME design engineering technical conferences >Layered manufacturiing with embedded components: process planning considerations
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Layered manufacturiing with embedded components: process planning considerations

机译：具有嵌入式组件的分层制造：过程计划注意事项

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摘要

This paper addresses the design and manufacturing of products with embedded components through layered manufacturing processes such as Shape Deposition Manufacturing (SDM). Embedding components allows the creation of novel designs such as "smart" products and integrated assemblies of sensors, actuators and other mechanical components. We present prototypes to illustrate the possibilities for such devices and we address the issues that constrain their process planning. Next, we present a combination of process planning algorithms and manufacturing methods that we have developed to support the design of layered products with embedded components.
机译：本文介绍了通过分层制造工艺（例如形状沉积制造（SDM））来设计和制造具有嵌入式组件的产品。嵌入组件允许创建新颖的设计，例如“智能”产品以及传感器，执行器和其他机械组件的集成组件。我们提供了原型来说明这种设备的可能性，并且我们解决了限制其工艺计划的问题。接下来，我们将结合过程规划算法和制造方法，以支持具有嵌入式组件的分层产品的设计。

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