首页> 外文会议>Proceedings of the 27th European solid-state device research conference >Source/Drain Engineering with Ge Large Angle Tilt Implantation and Pre-Amorphization to Improve Current Drive and Alleviate Floating Body Effects of Thin Film SOI MOSFET's
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Source/Drain Engineering with Ge Large Angle Tilt Implantation and Pre-Amorphization to Improve Current Drive and Alleviate Floating Body Effects of Thin Film SOI MOSFET's

机译:具有Ge大角度倾斜注入和预非晶化的源/漏工程,以改善电流驱动并减轻薄膜SOI MOSFET的浮体效应

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摘要

This work presents an advanced salicide technology for thin film silicon-On-Insulator(SOI) MOSFET's. Germanium large angle tilt implantation is applied to amorphize the silicon films prior to silicidation. This novel salicide technology greatly reduces the silicide formation energy and effectively controls the silicide depth. As a result, source/drain parasitic resistances are substantially reduced. In addition, due to the formation of a metal-semiconductor barrier near the source/channel junction, the floating body effects are alleviated.
机译:这项工作提出了一种用于绝缘体上薄膜(SOI)MOSFET的先进的自对准硅化物技术。在硅化之前,采用锗大角度倾斜注入来使硅膜非晶化。这种新颖的自对准硅化物技术大大降低了硅化物的形成能,并有效地控制了硅化物的深度。结果,源极/漏极寄生电阻大大降低。此外,由于在源极/沟道结附近形成了金属半导体势垒,浮体效应得以缓解。

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