首页> 外文会议>Proceedings of the 5th international conference on reliability of electrical products and electrical contacts >The Effect of Copper Particles on Contact Resistance Failure in Relay Production
【24h】

The Effect of Copper Particles on Contact Resistance Failure in Relay Production

机译:铜粉对继电器生产中接触电阻失效的影响

获取原文
获取原文并翻译 | 示例

摘要

Contact resistance failure is one of the major concerns in relay assembly line.This failure not only increases the cost of production, but also can lead to potential problem in early applications.In this paper, the effect of copper particles on contact resistance has been studied and the failure mechanism and root cause have been defined.It has been found that the copper particles on contact surface can cause the high contact resistance by two ways: one is forming copper oxides due to high temperature during relay sealing process and the other is accelerating mechanical wear and wear debris accumulation when contacts wipe during mechanical vibration process.
机译:接触电阻故障是继电器装配线的主要问题之一,这种故障不仅增加了生产成本,而且还可能导致早期应用中的潜在问题。本文研究了铜颗粒对接触电阻的影响已经发现,接触表面上的铜颗粒可通过两种方式引起高接触电阻:一种是由于继电器密封过程中的高温而形成氧化铜,另一种是加速机械磨损过程中,当触点擦拭时,机械磨损和磨损碎屑会累积。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号