首页> 外文会议>2018年第65回応用物理学会春季学術講演会講演予稿集 >Residual stress evaluation of GaN epitaxial layers transferred onto Si (100) substrate
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Residual stress evaluation of GaN epitaxial layers transferred onto Si (100) substrate

机译:GaN外延层转移到Si(100)衬底上的残余应力评估

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摘要

GaN based power devices have been fabricated on SiC, sapphire, and Si substrates.1 The output power densities of the devices are limited by the thermal conductivities of the substrate materials. If it is possible to transfer the GaN epitaxial layer onto diamond substrate with the highest thermal conductivity among materials, which would largely increase the output power density of the devices. In this work, we explored the transfer process of GaN epitaxial layer and investigated the residual stress of the GaN transferred onto Si (100) substrate.
机译:基于GaN的功率器件已在SiC,蓝宝石和Si衬底上制造。1器件的输出功率密度受衬底材料的热导率限制。如果有可能将GaN外延层转移到材料中导热率最高的金刚石基板上,这将大大提高器件的输出功率密度。在这项工作中,我们探索了GaN外延层的转移过程,并研究了转移到Si(100)衬底上的GaN的残余应力。

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