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STRAINED GERMANIUM MOSFETs: DEVICES AND PROCESS TECHNOLOGY

机译:应变锗MOSFET:器件和工艺技术

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摘要

Germanium p-MOSFETs with a thin high-k dielectric (EOT~1.6 nm) were fabricated on bulk Ge and epitaxial strained germanium-on-silicon substrates. These devices exhibited sub-90 mV/decade subthreshold swing and low gate leakage. The strained germanium p-MOSFETs showed 2X enhancement in hole mobility compared to silicon control devices, a 35% increase in mobility compared to similarly processed bulk germanium p-MOSFETs, and enhanced transconductance relative to bulk Ge p-MOSFETs.
机译:在块状锗和外延应变硅基锗衬底上制备了具有薄的高k电介质(EOT〜1.6 nm)的锗p-MOSFET。这些器件表现出低于90 mV /十年的亚阈值摆幅和低栅极漏电流。与硅控制器件相比,应变锗p-MOSFET的空穴迁移率提高了2倍,与类似处理的体锗p-MOSFET相比,迁移率提高了35%,并且相对于体Ge p-MOSFET增强了跨导。

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