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THRESHOLDS FOR EFFECTIVE INTERNAL GETTERING IN SILICON WAFERS

机译:硅晶片有效内部吸气的阈值

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摘要

The gettering of transition metals by Internal Gettering (IG) is an important tool for the management of metal contamination in IC processing. But unlike most external gettering systems, IG systems must be "set up" in a silicon wafer via a controlled precipitation of dissolved interstitial oxygen in the wafer during heat treatments. This paper addresses the question of the threshold to effective IG as the oxygen in the system goes from an essentially fully dissolved state to varying degrees of precipitation. The central step in the transition to an efficient gettering system is a morphological transformation of a growing oxygen cluster from an unstrained state to a strained platelet. Experimental data of the transformation rates as a function of nuclei site density and oxygen concentration are given. The dependence of the transformation rate has been successfully modeled and the time to create efficient IG systems as a function of site density, temperature and oxygen concentration is calculated.
机译:通过内部吸气剂(IG)吸取过渡金属是管理IC处理中金属污染的重要工具。但是,与大多数外部吸气系统不同,在热处理过程中,必须通过控制溶解的间隙氧在晶片中的沉淀,在硅晶片中“设置” IG系统。本文讨论了当系统中的氧气从基本上完全溶解的状态变为不同程度的沉淀时,有效IG阈值的问题。向高效吸气系统过渡的核心步骤是将生长中的氧簇从未应变状态转变为应变血小板的形态学转变。给出了转化率随核位置密度和氧浓度变化的实验数据。已经成功地模拟了转化率的依赖性,并计算了根据位点密度,温度和氧气浓度来创建高效IG系统的时间。

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