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首页> 外文会议>Proceedings vol.2004-14; Electrochemical Society(ECS) International Meeting and Symposium on Corrosion in Marine and Saltwater Environments II; 20041003-08; Honolulu,HI(US) >EFFECT OF CU CONTENT ON CORROSION BEHAVIOR AND CHROMATE CONVERSION COATING PROTECTION OF 7XXX SERIES AL ALLOYS
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EFFECT OF CU CONTENT ON CORROSION BEHAVIOR AND CHROMATE CONVERSION COATING PROTECTION OF 7XXX SERIES AL ALLOYS

机译：铜含量对7XXX系列合金腐蚀行为和铬酸盐转化膜保护的影响

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摘要

The roles of Cu content in corrosion behavior and CCC protection of AA7xxx-T6 were investigated using polarization and EIS techniques in combination with materials characterization techniques. Two breakdown potentials were found in Cu-containing alloys in deaerated chloride solution, and the values increased logarithmically with increasing Cu content. Transient dissolution of the fine hardening precipitates and the surrounding solid solution in a thin surface layer was found in the Cu-containing alloys polarized at potentials between the two breakdown potentials. Stable dissolution associated with combined IGC and selective grain attack was found above the second breakdown potential. EIS tests revealed that the overall influence of Cu on the corrosion behavior was detrimental due to Cu enrichment in aerated chloride solution. TEM and STEM analysis revealed that CCC was heterogeneous on the heterogeneous microstructure of AA7075-T6. The coatings formed on coarse intermetallic particles were much thinner than CCC formed on the matrix. Finally the Cu content can have different effects on CCC protection: Cu is beneficial to CCC protection for coatings formed on polished AA7xxx-T6, but Cu is detrimental if it is enriched on the surface prior to CCC formation.
机译：利用极化和EIS技术结合材料表征技术研究了铜含量在AA7xxx-T6的腐蚀行为和CCC保护中的作用。在脱气的氯化物溶液中，含铜合金中发现了两种击穿电位，并且随着铜含量的增加，其值对数增加。在两个击穿电位之间的电位下极化的含Cu合金中，细硬化沉淀物的瞬时溶解和周围的固溶体在薄表层中被发现。在第二次击穿电位以上，发现了与IGC和选择性晶粒侵蚀相结合的稳定溶解。 EIS测试表明，由于铜在充气氯化物溶液中的富集，因此铜对腐蚀行为的总体影响是有害的。 TEM和STEM分析表明，CCA在AA7075-T6的异质微观结构上是异质的。在粗金属互化物颗粒上形成的涂层比在基体上形成的CCC薄得多。最后，Cu含量可能对CCC保护有不同的影响：Cu有助于在抛光的AA7xxx-T6上形成的涂层对CCC的保护，但是如果Cu在形成CCC之前富集在表面上，则是有害的。

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