EFFECTS OF SURFACTANTS ON THE GROWTH CHARACTERISTICS OF ELECTROLESS COPPER FILMS

机译：表面活性剂对化学镀铜薄膜生长特性的影响

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This article reports on the effect of surfactants, such as Triton X-100, and polyethylene glycol with molecular weight 1000 (PEG-1000) on the growth characteristics of electroless copper films deposited onto smooth gold surfaces using a copper aqueous solution with formaldehyde as a reducing agent, and EDTA as complexing agent, deposition rate, density, resistivity, surface morphology of electroless copper films were investigated with the aid of some characterization techniques (profilometer, four point probe resistance, atomic force microscopy). It was found that PEG-1000 can be used to electroless copper deposition in order to get smooth copper surfaces with RMS roughness lower than 30nm for thicknesses lower than 2μm.

机译：本文报道了表面活性剂（例如Triton X-100和分子量为1000的聚乙二醇（PEG-1000））对使用铜水溶液和甲醛作为表面活性剂沉积在光滑金表面上的化学镀铜膜的生长特性的影响。还原剂和EDTA作为络合剂，借助一些表征技术（轮廓仪，四点探针电阻，原子力显微镜）研究了化学镀铜膜的沉积速率，密度，电阻率，表面形态。已发现PEG-1000可用于化学镀铜，以获得厚度小于2μm的RMS粗糙度小于30nm的光滑铜表面。

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《Proceedings vol.2005-08; International Symposium on Microelectronics Technology and Devices(SBMICRO 2005); 200509;》|2005年|P.204-210|共7页
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N.M.Hasan; S. G. dos Santos Filho; J.W.Swart;
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CCS-UNICAMP Cidade Universitaria "Zeferino Vaz"-CEP: 13083-870 - C. P. 6061-Campinas-SP-Brasil;

LSI-PSI-EPUSP Av. Prof. Luciano Gualberto, 158. Trav.3. 05508-900 - Sao Paulo - SP - Brasil;

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正文语种 eng
中图分类微电子学、集成电路（IC）;
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EFFECTS OF SURFACTANTS ON THE GROWTH CHARACTERISTICS OF ELECTROLESS COPPER FILMS

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