• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>Processing and Packaging of Semiconductor Lasers and Optoelectronic Devices >Si-based laser subassembly for telecommunications
【24h】

Si-based laser subassembly for telecommunications

机译：电信用硅基激光组件

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Abstract: is used as a packaging medium to integrate a laser, lenses, and a back facet monitor into a compact sub-assembly suitable for low-cost laser packages. The sub-assembly consists of separate laser and detector/optics submounts made of silicon. Only a single axis alignment is required during assembly to align the lenses (300 $mu@m diameter sapphire spheres) with the laser active area. In a single lens configuration, the integrated sub- assembly had 25% coupling efficiency into single-mode fiber compared to 30% maximum coupling efficiency achieved on the optical bench. Coupling efficiencies of the integrated sub- assembly to 50 $mu@m multi-mode fiber greater than 70% were achieved. The effective numerical aperture of the back facet monitor in the sub-assembly was greater than 0.7. !3
机译：摘要：用作包装介质，将激光器，透镜和背面监视器集成到适合低成本激光封装的紧凑型子组件中。该子组件由单独的激光和由硅制成的检测器/光学子安装座组成。在组装过程中只需要单轴对准即可将透镜（直径为300μm的蓝宝石球）对准激光有效区域。在单透镜配置中，集成子组件与单模光纤的耦合效率为25％，而在光学平台上的最大耦合效率为30％。达到了集成子组件与50μm多模光纤的耦合效率大于70％的要求。子组件中背面监视器的有效数值孔径大于0.7。 ！3

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号