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Near-tip fracture processes in ductile materials

机译:韧性材料的近端断裂过程

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Ductile fracture is generally considered to occur via void nucleation, growth, and colaescence mechanisms that result in a dimpled fracture appearance. For many materials, void initiation and growth take place at locations where there are hard particles or inclusions. However, ductile fracture involving void formation has been observed in planar slip materials that contain neither hard particles nor inclusions. Two different crack growth processes have also been identified: (1) direct crack extension into the crack-tip plastic zone and (2) indirect crack extension by microcrack nucleation ahead of the main crack. In this paper, the near-tip fracture processes in several structural alloys, inclduing Al-, Ti-, and Nb-base alloys, that exhibit ductile fracture in a variety of microstructures with and without hard particles are summarized. These fracture mechanisms are correlated with the microstructure and the fracture resistance curve to provide a basic understanding of the role of microstructure in the crack-tip fracture process, the transition from ductile to brittle fracture, and the source of fracture resistance. A possible mechanism for he formation of dimpled fracture in the planar slip materials is also proposed.
机译:通常认为延性断裂是通过空洞形核,生长和松弛机制而发生的,从而导致凹陷外观降低。对于许多材料,空隙的引发和生长发生在有硬颗粒或夹杂物的位置。然而,在既不包含硬颗粒也不包含夹杂物的平​​面滑动材料中,已经观察到涉及空隙形成的延性断裂。还确定了两种不同的裂纹扩展过程:(1)直接裂纹扩展到裂纹尖端塑性区;(2)通过主裂纹之前的微裂纹成核间接扩展裂纹。在本文中,总结了几种结构合金(包括Al,Ti和Nb基合金)的近端断裂过程,这些合金在具有和不具有硬质颗粒的各种微观结构中均表现出延性断裂。这些断裂机理与显微组织和断裂抗力曲线相关,以提供对显微组织在裂纹尖端断裂过程中的作用,从韧性断裂到脆性断裂的过渡以及断裂抗力来源的基本理解。还提出了在平面滑移材料中形成凹陷断裂的可能机理。

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