This paper addresses the approaches for using Ceramic Column Grid Arrays (CCGAs) in high reliability (Hi-Rel) space systems. While other grid array packaging exist (i.e. Ball Grid Arrays), the part quality (Military “Class S”) and radiation hardness requirements of Hi-Rel space systems drive the use of hermetic ceramic components. As will be discussed, the issues of thermal mismatch between ceramic and traditional printed wiring board (PWB) materials requires the use of CCGAs for advanced high pin count digital devices. Unfortunately, even the use of solder column arrays do not provide the same level of solder joint fatigue prevention as traditional compliant gull wing or dual-in-line (DIP) leaded packages. As a result, testing may be required to assure that the CCGA based design meets the wear-out lifetime requirements for Hi-Rel space systems.
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