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首页> 外文会议>Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS VI; Proceedings of SPIE-The International Society for Optical Engineering; vol.6463 >Critical comparison of metrology techniques for MEMS
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Critical comparison of metrology techniques for MEMS

机译：MEMS计量技术的关键比较

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MEMS Technology has become more ubiquitous in recent years but still metrology for MEMS materials has lagged in terms of standardization and common industry usage. MEMS metrology encompasses a very wide range of test methods for various kinds of functional and manufacturing characteristics of these devices but in this article we only refer to test techniques for extraction of mechanical properties essential to the product development process and process monitoring. These include methods such as test structures and other methods for measuring elastic modulus, Poisson 's ratio, residual stress and stress gradients, and CTE, etc. as well as properties important to device reliability such as creep, fatigue and wear. Metrology for MEMS materials has always included attempts by researchers and engineers to miniaturize existing macro level test methods like the uniaxial tensile test, hardness test, bulge test etc. but historically another approach has always existed in parallel. Novel on-wafer or on-chip test structures are continuously being developed in an attempt to achieve stream-lined in-line tests that don't require the "destructive" nature of the former group of test methods. The vision is that in-line methods would eventually be standardized to the point where they, in the mask layout phase, could be "dropped onto" wafer as in-line process control monitors (PCMs). Today, we're still far away from realizing this ideal situation in the sense that the ASTM standards list does not include a single unique test structure for material property extraction. The focus of this current article is to critically compare the various techniques that have been developed so far and contrast their viability and potential as candidates for standardization either in-line or off-line.
机译：近年来，MEMS技术已变得越来越普遍，但是在标准化和常见的行业使用方面，MEMS材料的计量仍然落后。 MEMS计量学涵盖了针对这些设备的各种功能和制造特性的非常广泛的测试方法，但在本文中，我们仅指用于提取对于产品开发过程和过程监控必不可少的机械性能的测试技术。这些包括测试结构之类的方法以及其他用于测量弹性模量，泊松比，残余应力和应力梯度以及CTE等的方法，以及对器件可靠性至关重要的特性，例如蠕变，疲劳和磨损。 MEMS材料的计量学一直包括研究人员和工程师试图使现有的宏观水平测试方法（例如单轴拉伸测试，硬度测试，凸出测试等）小型化的尝试，但是历史上一直并行存在另一种方法。不断开发新颖的晶圆上或芯片上测试结构，以尝试实现流线型在线测试，这些测试不需要前一组测试方法的“破坏性”本质。愿景是最终将在线方法标准化，以使它们在掩模布局阶段可以作为在线过程控制监视器（PCM）“滴到”晶圆上。如今，就ASTM标准列表不包括用于材料特性提取的单一唯一测试结构的意义而言，我们仍然离实现这种理想情况还很遥远。本文的重点是批判性地比较到目前为止已开发的各种技术，并比较它们作为在线或离线标准化候选者的可行性和潜力。

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