• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>Second International Symposium on Adhesive Joints: Formation, Characteristics and Testing Vol.2 May 22-24, 2000 Newark, New Jersey >Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics
【24h】

Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

机译：使用新型无损技术，通过应用高频电介质来监控粘合接头中的溶剂吸收

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

This paper presents the application of High Frequency Dielectric analysis (frequency and time domain) for the examination of adhesive bonded joints. Adhesive bonding of both primary and secondary structures within the aerospace and automotive industries is becoming evermore popular, necessitating further research into adhesive environmental aging processes and nondestructive evaluation (NDE). In this study, aluminum (chromic acid anodized) to aluminum, and carbon fiber reinforced plastic (CFRP) to CFRP epoxy bonded specimens were monitored, with respect to their aging environment. The aluminum joints were subjected to water under three temperature regimes (50 ℃, 65℃ and thermally stepped between these), with the bonded composite structures exposed at 65 ℃ to a variety of solvents, including water. The solvents selected were those typically found around aircraft in service, for example butanone, hydraulic fluid, ethylene glycol, aviation fuel and simulated sea water. The function of high frequency dielectric measurements as an NDE technique is introduced, with respect to solvent uptake within the system and the subsequent detection of voids and debonds caused by such solvent ingress. Destructive mechanical shear and cleavage test results are also commented on, which illustrate the excellent correlation achievable between mechanical strength and this new NDE approach. Such a correlation allows the user to probe and assess deterioration caused by such aging, within the adhesive and at its interface with the respective substrate layer.
机译：本文介绍了高频介电分析（频域和时域）在胶接接头检查中的应用。航空航天和汽车工业中一级结构和二级结构的胶粘粘合正变得越来越普遍，因此有必要对胶粘剂的环境老化过程和无损评估（NDE）进行进一步的研究。在这项研究中，对铝（铬酸阳极氧化）为铝，碳纤维增强塑料（CFRP）与CFRP环氧粘结试样进行了监测，以了解其老化环境。铝制接头在三种温度下（50℃，65℃并在它们之间进行热步进）经受水作用，粘结的复合结构在65℃下暴露于各种溶剂，包括水。选择的溶剂通常是在使用中的飞机周围发现的那些溶剂，例如丁酮，液压油，乙二醇，航空燃料和模拟海水。引入了高频电介质测量作为NDE技术的功能，涉及系统中的溶剂吸收以及随后检测到的此类溶剂进入所引起的空隙和脱胶。还对破坏性的机械剪切和解理测试结果进行了评论，这些结果说明了机械强度与这种新的NDE方法之间可以实现极好的相关性。这种相关性允许用户在粘合剂内以及在其与相应基底层的界面处探查和评估由这种老化引起的劣化。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号