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首页> 外文会议>SEMICON China 2004 Technical Programs >Jet Dispense for Electronic Packaging Applications
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Jet Dispense for Electronic Packaging Applications

机译：电子包装应用的喷射分配

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The scale of components used has consistently grown smaller and denser with the advances and improvements in technology of the electronics and optoelectronic industry,. This has allowed for more efficient use of resources (a silicon chip that once held hundreds of transistors now holds millions) and more convenient and consumer friendly products (palm sized computers compared to warehouse sized computers forty years ago). However, as advances lead to decreases in the scale of components, similar advances must be made in the production process in order to assemble these components. When applying the Surface Mount Adhesives (SMA), for instance, it is vital that the adhesives do not cover any part of the electrical leads, as this may decrease the quality of the solder connection and increase the electrical resistance. As components decrease in size, so does the gap between the leads. It is therefore necessary for the size of the adhesive dot to decrease to the same degree as the components decrease. Current jet technology can produce dots of surface mount adhesive of approximately 225E-6 m or about 3.5E-9 liters of volume. The underfilling of 3D-packages with small gaps, yet large geometries, that are required to accomplish thin packages, as well as the underfilling of small die present yet another challenge to the consistency and accuracy of dispensing processes. The challenge of jetting abrasive materials is addressed here by monitoring wearout evolution on the jet itself and corresponding effects on the jetted fluid characteristics. Underfill jetting accuracy from small to large die, is presented, this volumetric consistency exceeds today most process requirements. This paper proposes a solution to this dispense challenge by way of the non-contact “Jetting Underfill” for both, traditional capillary flow and “Forced Flow Underfilling,” commonly known as “No-flow Underfilling.” An alternative to the traditional seal pass dispensing is proposed whereby dispensing time is shorten significantly and acceptable and reliable die fillet is accomplished by way of jetting techniques. Display panels also require fluid dispensing; this paper will address the advantages in non-contact and high throughput that can be obtained with jetting of UV materials at frequencies as high as 200 Hz. A model is proposed to simulate jetting process analytically along with some experimental data.
机译：随着电子和光电子工业技术的进步和改进，所使用的组件的规模一直变得越来越小和越来越密集。这样可以更有效地利用资源（一个曾经拥有数百个晶体管的硅芯片，现在可以拥有数百万个硅芯片）和更方便且对消费者友好的产品（掌上大小的计算机与40年前的仓库大小的计算机相比）。然而，由于进步导致部件规模的减小，为了组装这些部件，必须在生产过程中取得类似的进步。例如，在使用表面贴装粘合剂（SMA）时，至关重要的是粘合剂不能覆盖电线的任何部分，因为这可能会降低焊接连接的质量并增加电阻。随着元件尺寸的减小，引线之间的间隙也会减小。因此，粘合剂点的尺寸必须减小到与组分减少相同的程度。当前的喷射技术可产生约225E-6m或约3.5E-9升体积的表面贴装胶粘剂点。完成薄包装所需的间隙很小但几何形状较大的3D包装的底部填充以及小模具的底部填充对分配过程的一致性和准确性提出了又一个挑战。在这里，通过监控喷嘴本身的磨损演变以及对喷射流体特性的相应影响，可以解决喷射磨料的挑战。提出了从小到大模具的底部填充喷射精度，这种体积一致性超过了当今大多数工艺要求。本文针对传统的毛细管流和“强制流式底部填充”（通常称为“非流式底部填充”）采用非接触式“喷射式底部填充”，提出了解决这一分配难题的解决方案。提出了一种对传统的密封通过分配的替代方案，其中，分配时间显着缩短，并且通过喷射技术实现了可接受且可靠的模具圆角。显示面板还需要分配液体；本文将探讨通过以高达200 Hz的频率喷射UV材料可以获得的非接触式和高通量的优势。提出了一个模型来分析喷射过程以及一些实验数据。

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