Challenges and Solutions for Future Internet-of-Things Semiconductor Technologies

机译：未来物联网半导体技术的挑战和解决方案

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Emerging IoT edge-node applications demand new capabilities from semiconductor technologies including unparalleled energy efficiency, reduced package form factor via increased integration, wireless connectivity across a range of low-power wireless protocols, embedded memory for operating systems with smaller footprint and longer battery life, and low cost. This paper will detail these challenges and show why future fully-depleted silicon-on-insulator technologies, such as 22FDX technology, possess the salient features to satisfy these requirements and enable future generations of IoT devices.

机译：新兴的IoT边缘节点应用需要半导体技术的新功能，包括无与伦比的能效，通过增强集成来降低封装尺寸，跨一系列低功耗无线协议的无线连接，用于操作系统的嵌入式内存（具有更小的占地面积和更长的电池寿命），而且成本低。本文将详细介绍这些挑战，并说明为什么未来的完全耗尽的绝缘体上硅技术（例如22FDX技术）具有满足这些要求并支持下一代IoT设备的显着特征。

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《Silicon compatible materials, processes, and technologies for advanced integrated circuits and emerging applications 6》|2016年|17-21|共5页
会议地点 San Diego(US)
作者
J. K. Schaeffer;
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GLOBALFOUNDRIES, Santa Clara, CA 95054, USA;

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正文语种 eng
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Challenges and Solutions for Future Internet-of-Things Semiconductor Technologies

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