IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, NY 10598, USA;
机译:低于45 nm CMOS技术在性能,可变性和可靠性方面的挑战和机遇
机译:用于非易失性存储器和突触设备的CMOS兼容TA_2O_5 Memitistor的丝状和接口切换
机译:片上胶体量子点器件,具有CMOS兼容架构,可用于近红外光敏
机译:CMOS兼容高性能Ⅲⅴ设备:机遇和挑战
机译:批量CMOS反相和累加器件的性能分析和扩展机会。
机译:具有片上系统应用混合传感器/存储器特性的CMOS兼容多晶硅纳米线器件
机译:CMOS兼容装置中的集成2D石墨烯氧化物薄膜增强光学非线性性能