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首页> 外文会议>Symposium on Molecular Functions of Electroactive Thin Films was held during the Fall Meeting of The Electrochemical Society, November 1-6, 1998 in Boston, Massachusetts. >Electrochemical interaction among organosulfur compounds, metal Ion and polyaniline at Cu electrode surface
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Electrochemical interaction among organosulfur compounds, metal Ion and polyaniline at Cu electrode surface

机译：铜电极表面有机硫化合物，金属离子和聚苯胺之间的电化学相互作用

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Adsorption behaviors of 2,5-dimercapto-1,3,4-thiadiazole (DMcT) on Cu electrode surfaces were studied using a 5 MHz-quartz crystal microbalance (QCM) and X-ray photoelectron spectroscopy (XPS). Contacting with a DMcT-containing solution, a Cu electrode spontaneously dissolved to form Cu(I) ion. XPS experimental results confirmed the formation of a complex between Cu(I) ion and DMcT on the Cu electrode surface. The thickness of the complex layer on the surface was estimated to be ca. 50 nm. A polyaniline (PAni) film coating protected a Cu electrode surface from the dissolution and thus the Cu(I)-DMcT complex layer became thinner (< 5nm). IT was expected that the Cu-DMcT complex accelerated electron flows in a composite cathode composed of DMcT and PAni. In this study, Stopped-flow experiments were also carried out for kinetic studies on the electron-transfer reactions between PAni and DMcT.
机译：使用5 MHz石英晶体微天平（QCM）和X射线光电子能谱（XPS）研究了2,5-二巯基1,3,4-噻二唑（DMcT）在Cu电极表面的吸附行为。与含DMcT的溶液接触后，Cu电极自发溶解以形成Cu（I）离子。 XPS实验结果证实了铜电极表​​面上的Cu（I）离子和DMcT之间形成了络合物。该表面上的复合层的厚度估计为约1埃。 50纳米聚苯胺（PAni）薄膜涂层可保护Cu电极表面免于溶解，因此Cu（I）-DMcT复合层变得更薄（<5nm）。据IT预计，Cu-DMcT复合物会加速电子在由DMcT和PAni组成的复合阴极中流动。在这项研究中，还进行了止流实验，以研究PAni和DMcT之间的电子转移反应。

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