首页> 外文会议>Symposium on Power Semiconductor Materials and Devices December 1-4, 1997, Boston, Massachusetts, U.S.A. >Localized lifetime control in silicon bipolar power devices by voids induced by He ion implantation
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Localized lifetime control in silicon bipolar power devices by voids induced by He ion implantation

机译:He离子注入引起的空穴在硅双极型功率器件中的局部寿命控制

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摘要

Localized lietime control in silicon bipolar devices is presented and discussed. It was achieved by formation of a void layer by He ion implantation. The void formation is reviewed and the viod properties are described and carefully considered. Simulations demonstrate the advantages of using localized lifetime control, while the innovative method is applied to fabrication of high speed Insulated Gate Bipolar Transistors.
机译:提出并讨论了硅双极器件中的局部时空控制。这是通过氦离子注入形成空隙层而实现的。审查了空隙的形成,并描述和仔细考虑了其气孔性能。仿真证明了使用局部寿命控制的优势,而该创新方法则用于制造高速绝缘栅双极晶体管。

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