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首页> 外文会议>Symposium F: Third International Conference on Laser Ablation (Cola'95) of the 1995 E-Mrs Spring Conference May 22-26, 1995 Strasbourg, France >Cleaning of copper traces on circuit boards with excimer laser radiation
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Cleaning of copper traces on circuit boards with excimer laser radiation

机译：用准分子激光辐射清洁电路板上的铜迹

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摘要

Cleaning of Cu traces on circuit boards is studied using pulsed excimer laser radiation (pulse width approx 20 ns, wavelength 248 nm), with the goal of improving the properties of the Cu surface for soldering and bonding. Traces with well-defined oxide overlayers are cleaned by irradiation in air using <=10~3 laser pulses at fluences per pulse of <=2 J cm~(-2). After treatment the surface morphology is analyzed using optical microscopy, optical profilometry, and scanning electron microscopy, while the chemical state of the surface is investigated with X-ray photoelectron (XPS) spectroscopy. Ellipsometry is used to determine the oxide overlayer thickness. Prior to cleaning samples exhibit a contamination overlayer about 15-25 nm in thickness containing Cu_2O and C. Cleaning reduces the overlayer thickness to <=10 nm by material removal. The process tends to be self-limiting, since the optical reflectivity of the oxidized Cu surface for laser radiation is removal. The process tends to be self-limiting, since the optical reflectivity of the oxidized Cu surface for laser radiation is smaller than that of the cleaned surface. Additionally, the interaction with the laser radiation results in surface segregation of a minor alloy component out of the bulk (e.g. Zn), which may help to passivate the surface for further chemical reactions.
机译：研究了使用脉冲准分子激光辐射（脉冲宽度约20 ns，波长248 nm）清洁电路板上的铜迹线，目的是改善用于焊接和粘合的铜表面的性能。通过在空气中使用<= 10〜3个激光脉冲以每脉冲通量<= 2 J cm〜（-2）的辐照，清洁具有清晰氧化物覆盖层的痕迹。处理后，使用光学显微镜，光学轮廓仪和扫描电子显微镜分析表面形态，同时使用X射线光电子（XPS）光谱研究表面的化学状态。椭偏法用于确定氧化物覆盖层的厚度。在清洁之前，样品会显示出约15-25 nm的污染覆盖层，其中包含Cu_2O和C。清洁会通过材料去除将覆盖层厚度减小至<= 10 nm。由于去除了用于激光辐射的氧化铜表面的光反射率，因此该过程趋于自限。由于氧化的Cu表面对激光辐射的光反射率小于清洁后的表面的光反射率，因此该过程趋于自我限制。另外，与激光辐射的相互作用导致次要合金成分从本体（例如，Zn）中分离出来，这可能有助于钝化表面以进行进一步的化学反应。

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