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首页> 外文会议>TMS(The Minerals, Metals amp; Materials Society) Annual Meeting; 20050213-17; San Francisco, CA(US) >LASER CLADDING OF W-CU COMPOSITE ON BRONZE SUBSTRATE
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LASER CLADDING OF W-CU COMPOSITE ON BRONZE SUBSTRATE

机译：W-CU复合材料在青铜基板上的激光熔覆

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摘要

The feasibility of depositing W-Cu composite overlays on bronze substrate by laser cladding technique was explored. Two types of tungsten powders, with an average size of 10 μm and 32 μm, were used to deposit coatings with various thicknesses. Metallographic analysis of the composite coatings reveals that, due to the poor wetting behaviour, tungsten particles tend to separate from the copper molten pool or coalesce and segregate within the molten pool. The coalescence and separation of the particles occur more easily for the fine powders than for the coarse ones, making it simpler to deposit dense and uniform coatings using coarse tungsten powders. Laser cladding of dense and uniform coatings thicker than 1 mm was proven to be difficult, because the separation of tungsten particles from copper substrate occurs after reaching certain coating thickness, forming a tungsten particles-free copper layer covered with a tungsten particles-rich layer. After these partition layers develop to their critical thicknesses, localized separation occurs, resulting in a series of discontinuous tungsten-free copper areas surrounded by tungsten particles-rich areas. Nickel addition enhances the possibility of depositing uniform and dense W-Cu composite coatings, preventing or limiting the segregation and separation of the constituents. The preliminary results indicate that, by adjusting processing parameters and powder-blend compositions, it is feasible to fabricate dense and uniform W-Cu overlays with various thicknesses that are metallurgically bonded to the substrates.
机译：探讨了通过激光熔覆技术在青铜基体上沉积钨铜复合材料的可行性。使用两种平均尺寸为10μm和32μm的钨粉来沉积各种厚度的涂层。复合涂层的金相分析表明，由于不良的润湿行为，钨颗粒往往会从铜熔池中分离或聚结并在熔池中偏析。细粉比粗粉更容易发生颗粒的聚结和分离，这使得使用粗钨粉更容易沉积致密且均匀的涂层。事实证明，对厚度大于1 mm的致密且均匀的涂层进行激光熔覆是困难的，因为在达到一定涂层厚度后会发生钨颗粒与铜基材的分离，从而形成覆盖有富含钨颗粒层的无钨颗粒铜层。在这些分隔层发展到其临界厚度之后，发生局部分离，从而导致一系列不连续的无钨铜区域，周围是富含钨颗粒的区域。镍的添加增加了沉积均匀且致密的W-Cu复合涂层的可能性，从而防止或限制了成分的分离和分离。初步结果表明，通过调整工艺参数和粉末共混物组成，可以制造出各种厚度的致密且均匀的W-Cu覆盖层，并冶金结合到基底上。

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