Sandwich microstrip lines with polymer dielectric for high speed on chip interconnects

机译：具有聚合物电介质的三明治微带线，用于高速片上互连

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Polymer-based sandwich microstrip transmission lines are investigated for the use as ultrafast interconnects in microelectronic circuits. Electronic-grade Benzocy-clobutene (Cyclotene) is applied as dielectric medium. Optoelectronic pulse-propagation measuremetns comparing the microstrip lines with standard coplanar waveguides show that the waveguides are free of modal dispersion up to the highest frequencies of 1.2 THz. Signal attenuation is low (<=1 dB/mm at 0.1 THz, approx approx 6 dB/mm at 1.2 THz), dominated by cnductor losses. Radiation losses are negligible for all sandwich microstrip lines tested. Shielding by the ground conductor ensures that the waveguides are immune against Drude absorption in lossy substrates.

机译：研究了基于聚合物的三明治微带传输线，将其用作微电子电路中的超快互连。电子级苯并环丁烯（环丁烯）用作介电介质。将微带线与标准共面波导进行比较的光电脉冲传播测量结果表明，在最高1.2 THz的频率下，波导没有模态色散。信号衰减低（在0.1 THz时<= 1 dB / mm，在1.2 THz时大约6 dB / mm），主要由电感损耗决定。对于所有测试的夹心微带线，辐射损耗可以忽略不计。接地导体的屏蔽可确保波导不受损耗衬底中Drude吸收的影响。

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来源
《Ultrafast electronics and optoelectronics》|1997年|p.97-101|共5页
会议地点 Incline Village NV(US)
作者
H.-M.Heiliger; M.Nagel; H.G.Roskos; R.Hey; H.Kurz;
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原文格式 PDF
正文语种 eng
中图分类无线电电子学、电信技术;
关键词
Thin-film microstrip lines, Ultrafast measurements, Polymer waveguides, Optoelectronics;

机译：薄膜微带线，超快测量，聚合物波导，光电;

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专利

1. Al-SiO/sub 2/-Al sandwich microstrip lines for high-frequency on-chip interconnects [J] . Gondermann J., von Kamienski E.G.S. IEEE Transactions on Microwave Theory and Techniques . 1993,第12期

机译：用于高频片上互连的Al-SiO / sub 2 / -Al夹心微带线
2. INVESTIGATION OF INTERCONNECT LOSS DUE TO COUPLING BETWEEN TWO PARALLEL MICROSTRIP LINES IN HIGH-SPEED DESIGN [J] . Li-Ping Li, Yu-Shan Li, Jian Pan, Microwave and optical technology letters . 2008,第1期

机译：高速设计中两条平行微带线耦合引起的互连损耗研究
3. Minimization of Via-Induced Signal Reflection in On-Chip High Speed Interconnect Lines [J] . K. Soorya Krishna, M.S. Bhat Circuits, systems, and signal processing . 2012,第2期

机译：片上高速互连线中的过孔感应信号反射最小化
4. Sandwich microstrip lines with polymer dielectric for high speed on chip interconnects [C] . H.-M.Heiliger, M.Nagel, H.G.Roskos, Topical meeting ultrafast electronics and optoelectronics . 1997

机译：夹层微带线具有高速电介质，用于高速芯片互连
5. Study of Conduction Behavior in Dielectrics in Chip Level Interconnects: Detection of Defects in Al/SiO2 Interconnects [D] . Lu, Po-Cheng. 2018

机译：芯片级互连中电介质中导电行为的研究：Al / SiO2互连中缺陷的检测
6. A Microwave Platform for Reliable and Instant Interconnecting Combined with Microwave-Microfluidic Interdigital Capacitor Chips for Sensing Applications [O] . Juncheng Bao, Gertjan Maenhout, Tomislav Markovic, 2020

机译：用于传感应用的可靠且即时互连的微波平台与微波-微流体叉指电容器芯片的组合
7. Resonant coupling type microstrip line interconnect using a bonding ribbon and dielectric pad [O] . Hotta, Masashi, Qian, Yongxi, Itoh, Tatsuo 1998

机译：使用键合带和电介质焊盘的谐振耦合型微带线互连
8. Comparison of Gold and Superconductors Used as Air-Bridge and Microstrip Interconnects for High-Speed VLSI (Very Large Scale Integration). [R] . Dykstra, J., Brown, R. B. 1989

机译：用作高速VLsI（超大规模集成电路）的空气桥和微带互连的金和超导体的比较。

Sandwich microstrip lines with polymer dielectric for high speed on chip interconnects

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