首页> 外文会议>DE-vol.119; CED-vol.11; American Society of Mechanical Engineers(ASME) International Mechanical Engineering Congress and Exposition; 20061105-10; Chicago,IL(US) >'FREE TRANSVERSE VIBRATIONS OF ORTHOTROPIC COMPOSITE MINDLIN PLATES or PANELS WITH A NON-CENTRALLY BONDED SYMMETRIC LAP JOINT (or SYMMETRIC DOUBLER JOINT)'
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'FREE TRANSVERSE VIBRATIONS OF ORTHOTROPIC COMPOSITE MINDLIN PLATES or PANELS WITH A NON-CENTRALLY BONDED SYMMETRIC LAP JOINT (or SYMMETRIC DOUBLER JOINT)'

机译:'带有非中心结合的对称搭接接头(或对称双凸接头)的正交各向异性复合Mindlin板或面板的横向振动

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The problem of the "Free Transverse Vibrations of Orthotropic Composite Mindlin Plates or Panels with a Non-Centrally Bonded Symmetric Lap Joint (or Symmetric Doubler Joint)" is theoretically analyzed and solved with some numerical results. The "Bonded Joint" system is composed of two dissimilar, orthotropic plate "adherends" non-centrally bonded and connected by a dissimilar, orthotropic "doubler" plate through a very thin and elastic adhesive layer. The "adherends" and the single "doubler" are taken into account as the "Mindlin Plates" with the transverse shear deformations and the transverse and the rotary moments of inertia. The adhesive layer is considered as a linearly elastic continuum with the transverse normal and shear stresses. The damping effects are neglected. The dynamic equations of the plate "adherends", the "doubler" plate and the adhesive layer in combination with the stress resultant-displacement expressions, after some algebraic manipulations, are finally reduced to a set of the "Governing System of the First Order Ordinary Differential Equations" in matrix form in terms of the "state vectors" of the problem. The aforementioned set of the "Governing Equations" is integrated by means of the "Modified Transfer Matrix Method (MTMM) (with Interpolation Polynomials)". Several mode shapes with their corresponding natural frequencies are presented for the "hard" and the "soft" adhesive cases. It was found that there are significant differences in mode shapes and natural frequencies corresponding to the "hard" and the "soft" adhesive cases. Additionally, some parametric studies such as the effects of the "Bonded Joint Length Ratio" and the "Bonded Joint Position Ratio" on the natural frequencies are included in this first study.
机译:从理论上分析并解决了“正交各向异性复合Mindlin板或具有非中央键对称的搭接接头(或对称的Doubler接头)的板的横向振动”问题,并通过一些数值结果解决了该问题。 “ Bonded Joint”系统由两个非正交的正交异性正交板“粘附物”组成,并通过非常薄且有弹性的粘合剂层通过一个非正交的正交异性“双面”板连接。 “被粘物”和单个“倍增器”被视为具有横向剪切变形以及横向和旋转惯性矩的“ Mindlin板”。粘合剂层被认为是具有横向法向应力和剪切应力的线性弹性连续体。忽略了阻尼作用。经过一些代数运算后,板“被粘物”,“双板”板和粘合剂层的动力学方程与应力合力位移表达式相结合,最终被简化为一组“一阶普通控制系统”就问题的“状态向量”而言,矩阵形式的“微分方程”。借助于“改进的传递矩阵方法(MTMM)(带有插值多项式)”对上述一组“控制方程”进行积分。对于“硬”和“软”粘合盒,提出了几种具有其固有频率的模态形状。发现与“硬”和“软”粘合盒相对应的模式形状和固有频率存在显着差异。此外,此第一项研究还包括一些参数研究,例如“键合接头长度比”和“键合接头位置比”对固有频率的影响。

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