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首页> 外文会议>DE-vol.119; CED-vol.11; American Society of Mechanical Engineers(ASME) International Mechanical Engineering Congress and Exposition; 20061105-10; Chicago,IL(US) >DESIGN OF A SPATIAL ELECTRONIC CIRCUIT CARRIER BY THE EXAMPLE OF A MINIATURE ROBOT
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DESIGN OF A SPATIAL ELECTRONIC CIRCUIT CARRIER BY THE EXAMPLE OF A MINIATURE ROBOT

机译：以微型机器人为例的空间电子电路载体设计

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Miniaturization, high reliability and low manufacturing costs require close spatial integration of mechanics and electronics. New production technologies such as MID (Molded Interconnect Devices), with which spatial electronic circuit carriers can be manufactured, offer intriguing possibilities. However, these production technologies already determine the product concepts. The product and the production system development must be interrelated. This development will be shown through the example of a miniature robot. The miniature robot is supposed to be manufactured in large quantity. It is to act as an experimental object for swarm intelligence and multi-agent applications of computer science, as well as using the Technology MID. A new methodology is necessary for the design of systems with MID. This paper describes first a procedural model for the integrated design of 3-D molded interconnect devices. And then it presents the specification techniques for the constant cross-domain description of such systems, from the principal solution to prototypes. The procedure and the application of the specification techniques are shown through the example of the housing of an autonomous miniature robot.
机译：小型化，高可靠性和低制造成本要求机械和电子技术在空间上紧密结合。诸如MID（模制互连设备）之类的新生产技术可用来制造空间电子电路载体，这提供了令人感兴趣的可能性。但是，这些生产技术已经确定了产品概念。产品与生产系统的开发必须相互联系。这种发展将通过微型机器人的例子来展示。微型机器人应该被大量生产。它充当计算机科学的群体智能和多代理应用程序以及使用Technology MID的实验对象。采用MID的系统设计必须采用一种新的方法。本文首先介绍3D模制互连设备集成设计的过程模型。然后，它提出了从基本解决方案到原型的用于此类系统的恒定跨域描述的规范技术。通过自主微型机器人外壳的示例显示了规范技术的过程和应用。

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