High Thermal Dissipation Apparatus for U V LEDs Application

著录项

• 来源
  《Wide bandgap semiconductor materials and devices 12》|2011年|p.35-39|共5页
• 会议地点 Montreal(CA);Montreal(CA)
• 作者

  Ray-Hua Horng; Hung-Lieh Hu; Re-Ching Lin; Yi-Chen Chiang;

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• 作者单位

  Department of Electro-Optical Engineering, National Cheng Kung University, Tainan, Taiwan,Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan;

  Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan;

  Research Center for Advanced Industry Technology and Precision Processing, National Chung Hsing University, Taichung, Taiwan;

  Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 材料;
• 关键词

  UV LED; composite electroplating; copper-diamond sheet; heat dissipation; thermal resistance;

  机译：紫外线LED;复合电镀铜金刚石板散热热阻;