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首页> 外文会议>World Tribology Congress III 2005 vol.2 >FRICTION BEHAVIOR OF CMP SLURRIES BASED ON NOVEL ORGANIC PARTICLES
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FRICTION BEHAVIOR OF CMP SLURRIES BASED ON NOVEL ORGANIC PARTICLES

机译：基于新型有机颗粒的CMP浆料的摩擦行为

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With the integration of copper as interconnect and low k materials as dielectric, the CMP community is facing an ever increasing demand on reducing defectivity without scarifying production throughput. One such strategy is to significantly lower the polishing pressure to below 1 psi. Such a move has placed tremendous challenges to the tool manufactures, consumable suppliers (especially the slurry vendors), and end-users. It is a challenge to remain the high throughput (MRR and selectivity) at low down force without using harsh abrasives. For the first time, we recently report the use of novel hydrophilic organic particles for metal CMP. Unlike conventional abrasive particles such silica or alumina, these unique particles are designed to specifically interact with the metal surface to be polished and significantly modify the Theological behavior of the slurry. The obvious advantage of using such particles is the reduction of defects during CMP. The consequence of using such particles is also its ability to provide unsurpassed high selectivity in removal rate for copper over barrier and dielectric materials due to their weak interaction with these particles. The added benefit for slurry that uses such particles is to allow CMP process conducted at a lower down force without compromising the throughput. In this talk, some basic physical and chemical characteristics of the particles and slurry will be first presented. The friction beavior of these new slurries in relation to conventional slurries on blanket wafers will be discussed. The impact of particle hydrophobicity on the friction behviors of the slurries will be explored.
机译：随着铜作为互连和低k材料作为电介质的集成，CMP社区面临着不断减少的缺陷（不降低产量）的需求。一种这样的策略是将抛光压力显着降低到1 psi以下。这一举动给工具制造商，消耗品供应商（尤其是浆料供应商）和最终用户带来了巨大挑战。在不使用刺激性磨料的情况下，在低下压力下保持高产量（MRR和选择性）是一个挑战。我们最近第一次报告了新型亲水有机颗粒用于金属CMP的应用。与常规的磨料颗粒（例如二氧化硅或氧化铝）不同，这些独特的颗粒被设计为与待抛光的金属表面发生特殊相互作用，并显着改变浆料的流变行为。使用这种颗粒的明显优势是减少了CMP过程中的缺陷。使用这样的颗粒的结果还在于，由于其与这些颗粒的弱相互作用，其能够提供超过阻挡层和介电材料的铜去除率极高的选择性。使用此类颗粒的浆料的附加好处是可以在不降低生产能力的情况下以较低的下压力进行CMP工艺。在本次演讲中，将首先介绍颗粒和浆液的一些基本物理和化学特性。将讨论这些新浆料相对于橡皮布晶圆上常规浆料的摩擦性能。将探讨颗粒疏水性对浆料摩擦性能的影响。

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