首页> 外文会议>World Tribology Congress III vol.1; 20050912-16; Washington,DC(US) >A MODEL FOR ANALYZING MULTI-ASPERITY CONTACT OF THIN SHEETS WITH REAL SURFACES ON BOTH SIDES
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A MODEL FOR ANALYZING MULTI-ASPERITY CONTACT OF THIN SHEETS WITH REAL SURFACES ON BOTH SIDES

机译:两面均具有真实表面的薄板的多粗糙接触分析模型

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摘要

A model for two-sided contact of a thin sheet of material, with real surfaces on both sides is presented. The model combines cylindrical-contact equations, with Euler-Bernoulli beam theory to examine the importance of substrate rigidity in two-sided contact problems. A finite difference program for solving this model is developed. Results for two-sided contact of numerically generated surfaces on thin tapes are presented. The effects of tape thickness and tension are explored. It is shown that substrate's bending rigidity contributes significantly to the overall equilibrium, for typical tape thicknesses and tension values used by the industry. However, large thickness values exists for which substrate bending is negligible and elastic half-space solutions applied to both sides of the tape are adequate.
机译:提出了一种材料薄板的两侧接触模型,该模型的两面都具有真实表面。该模型将圆柱接触方程式与Euler-Bernoulli梁理论相结合,以研究基板刚度在双面接触问题中的重要性。开发了求解该模型的有限差分程序。给出了薄带上数值生成表面的两侧接触的结果。探索了胶带厚度和张力的影响。结果表明,对于行业使用的典型胶带厚度和张力值,基材的弯曲刚度显着有助于总体平衡。但是,存在较大的厚度值,对于该厚度值而言,可以忽略基板弯曲,并且施加到胶带两侧的弹性半空间解决方案就足够了。

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