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Investigation into the stress assisted damage of copper surface under single asperity: Influence of contact pressures, surfaces stress states and environments.

机译：单一粗糙条件下铜表面应力辅助损伤的研究：接触压力，表面应力状态和环境的影响。

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An experiment setup was used to investigate the effects of contact loads, surface stress state and surface environment on dissolution and damage of copper surface. A range of surface stress state was generated with a four-point-bending setup on a well-polished copper sample. Single asperity contact was investigated using the cantilever tip of an Atomic Force Microscope. Controlled tip contact pressures were applied on the copper surface to mechanically stimulate the stressed surface. The experiment was performed in different environments to determine the chemical effects. Volume of material removed during the process was measured to determine material removal rate as a function of contact pressure, surface stress state and environments. It shows, as expected, higher contact pressures accelerate the material removal rates but complicated behaviors of the effects of surface stress and environments were observed. Mechanics governing material removal and their removal to Chemical Mechanical Polishing of copper was discussed.

机译：实验装置用于研究接触载荷，表面应力状态和表面环境对铜表面溶解和破坏的影响。在抛光良好的铜样品上通过四点弯曲设置产生了一定范围的表面应力状态。使用原子力显微镜的悬臂尖端研究了单个粗糙接触。将受控的尖端接触压力施加到铜表面上，以机械刺激受应力的表面。实验在不同的环境中进行，以确定化学作用。测量在该过程中去除的材料的体积，以确定材料去除速率与接触压力，表面应力状态和环境的关系。正如预期的那样，它显示出更高的接触压力会加快材料去除速率，但观察到表面应力和环境影响的复杂行为。讨论了控制材料去除的机理及其在铜的化学机械抛光中的去除机理。

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作者
Chua, Bun Hiong.;
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作者单位

Iowa State University.$bMechanical Engineering.;

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授予单位 Iowa State University.$bMechanical Engineering.;
学科 Engineering Mechanical.
学位 M.S.
年度 2008
页码 87 p.
总页数 87
原文格式 PDF
正文语种 eng
中图分类机械、仪表工业;
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机译：单一粗糙条件下铜表面应力辅助损伤的研究：接触压力，表面应力状态和环境的影响

Investigation into the stress assisted damage of copper surface under single asperity: Influence of contact pressures, surfaces stress states and environments.

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