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Development of constitutive equation parameters and reliability evaluations of tin-silver-copper interconnects.

机译：锡-银-铜互连本构方程参数的开发和可靠性评估。

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摘要

Impact of introducing lead-free solder due to the legislation restriction, generates numerous researches to characterize the lead-free alloys and evaluate the interconnect reliability. The objective of this dissertation is to characterize the SnAgCu alloy and also evaluation of SAC solder interconnects reliability under different loadings. Solder material properties were measured at different stress/strain rates, and temperatures. Bulk solder tensile test specimens were developed where controlled cooling rate gives microstructures similar to bulk solder joint. Also a modified Iosipescu solder joint lap specimen for uniaxial shear testing was introduced. Thermo-mechanical viscoplastic material constitutive parameters were derived using a unified creep-plasticity model and incorporated it into commercial finite element solver. Verification of unified model with a partitioned model, where the elastic behavior is separated from rate-independent and rate-dependent behavior. The parameters developed are in line with similar studies. Temperature dependent coefficient of thermal expansion (CTE) was measured for SAC alloys with a derived linear correlation.; The influence of Au addition in SAC solder was studied for 0.5 to 2.5 weight percentage of Au. Stress-strain measurements showed that significant strength increase (20 to 30%) with higher strain range was observed for Au addition in SAC alloy.; Solder microstructure was studied for bulk and solder interconnects and influence of surface finishes were also investigated. Joint interface was investigated at different thermal aging conditions. Both scallop and cellular structure of Cu6Sn5 were observed at the interface.; SAC solder joint reliability was investigated under mechanical and thermomechanical loadings using three PWB pad finishes (immersion Ag, OSP and Ni/Au) by employing standardized thermal cycling, cyclic bend, and drop tests. Failure mechanisms were identified that affect the products in typical user environments. SAC joints passed 1000 thermal cycles whereas early failures observed under bend and drop loadings. It has been shown that, PWB pad finish and associated reflow profile had impacts on the interconnect reliability. The failures under mechanical loading are not only solder joint failures, but also Cu pad pull-out and resin coated Cu (RCC) trace failure. Drop and bend reliability for lead-free assemblies will require optimizing the solder strength with the strength of the PWB materials.
机译：由于法规限制而引入无铅焊料的影响，引起了众多研究来表征无铅合金并评估互连可靠性。本文的目的是表征SnAgCu合金，并评估SAC焊料互连在不同负载下的可靠性。在不同的应力/应变速率和温度下测量了焊锡材料的性能。开发了块状焊料拉伸测试样品，其中受控的冷却速率产生了类似于块状焊料接头的微观结构。还介绍了用于单轴剪切试验的改进型Iosipescu焊点搭接试样。使用统一的蠕变塑性模型导出热机械粘塑性材料的本构参数，并将其纳入商业有限元求解器。用分区模型验证统一模型，其中弹性行为与速率无关和速率相关行为分开。开发的参数与类似研究一致。测量了具有导出线性相关性的SAC合金的温度相关热膨胀系数（CTE）。研究了0.5％至2.5％（重量）的Au在SAC焊料中添加Au的影响。应力应变测量表明，在SAC合金中添加Au时，随着应变范围的增大，强度显着增加（20％至30％）。对块状和焊料互连的焊料微结构进行了研究，并研究了表面光洁度的影响。在不同的热老化条件下研究了接合界面。在界面处都观察到了扇贝和Cu6Sn5的细胞结构。通过采用标准化的热循环，循环弯曲和跌落测试，使用三种PWB焊盘表面处理（浸银，OSP和Ni / Au），研究了SAC焊点在机械和热机械载荷下的可靠性。确定了会在典型用户环境中影响产品的故障机制。 SAC接头经过1000次热循环，而在弯曲和跌落载荷下观察到早期破坏。已经表明，PWB焊盘的光洁度和相关的回流曲线对互连的可靠性有影响。机械负载下的故障不仅是焊点故障，而且是铜焊盘拉出和树脂涂覆的铜（RCC）迹线故障。无铅组件的跌落和弯曲可靠性将需要利用PWB材料的强度来优化焊接强度。

著录项

  • 作者

    Hossain, Mohammad Masum.;

  • 作者单位

    The University of Texas at Arlington.;

  • 授予单位 The University of Texas at Arlington.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2006
  • 页码 351 p.
  • 总页数 351
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;
  • 关键词

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