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Experimental study of the residual stress-induced self-assembly of MEMS structures during deposition.

机译：沉积过程中残余应力引起的MEMS结构自组装的实验研究。

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摘要

The possibility of using residual stresses favorably as a means of self-assembling MEMS during material deposition is experimentally investigated. Two atomic force microscope cantilevers are placed in contact at their free ends. Material is isothermally electroplated onto one (the deposition) cantilever, but no material is deposited onto the other (spring) cantilever. The deposited layer contains residual stresses that deform the deposition cantilever. The deposition cantilever in turn deforms the spring cantilever, thereby doing work in the spring cantilever and proving that the two structures can self-assemble during deposition processing. An insoluble nickel electroplating process and an all-sulfate nickel solution are used for the deposition. The deflection of the self-assembled cantilevers is measured in-situ as a function of the deposited thin film thickness through the optical method of atomic force microscopy.; The experimental results are compared to an analytical model which consists of Euler-Bernoulli beam theory that is modified to account for moving boundaries as the material is deposited. The model accounts for the through-thickness variation of the intrinsic strain during the electroplating. Closed-form solutions are not possible, but numerical solutions are plotted for the cantilever deflection and work on the spring cantilever as functions of the deposition thickness.
机译：实验研究了在材料沉积过程中将残余应力有利地用作自组装MEMS的可能性。两个原子力显微镜悬臂在其自由端处接触放置。将材料等温电镀到一个（沉积）悬臂上，但是没有材料沉积在另一个（弹簧）悬臂上。沉积层包含残余应力，这些残余应力会使沉积悬臂变形。沉积悬臂又使弹簧悬臂变形，从而在弹簧悬臂中进行工作，并证明这两个结构在沉积过程中可以自组装。沉积使用不溶性镍电镀工艺和全硫酸镍溶液。通过原子力显微镜的光学方法，根据沉积的薄膜厚度就地测量自组装悬臂的挠度。将实验结果与由Euler-Bernoulli束理论组成的分析模型进行比较，该模型经过修改以考虑材料沉积时的移动边界。该模型说明了电镀过程中固有应变的整个厚度变化。闭合形式的解决方案是不可能的，但是绘制了悬臂挠度的数值解，并根据沉积厚度对弹簧悬臂进行了求解。

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