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首页> 外文学位 >Comparison of interconnect failures of electronic components mounted on FR-4 boards with tin37lead and tin3.0silver0.5copper solders under rapid loading conditions.
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Comparison of interconnect failures of electronic components mounted on FR-4 boards with tin37lead and tin3.0silver0.5copper solders under rapid loading conditions.

机译：比较在快速负载条件下使用tin37lead和tin3.0silver0.5copper焊料安装在FR-4板上的电子组件的互连故障。

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摘要

Electronic circuit boards can experience rapid loading through shock or vibration events during their lives; these events can happen in transportation, manufacture, or in field conditions. Due to the lead-free migration, it is necessary to evaluate how this rapid loading affects the durability of a leading lead free solder alternative (Sn3.0Ag0.5Cu) assemblies as compared with traditional eutectic lead based solder Sn37Pb assemblies. A literature review showed that there is little agreement on the fatigue behavior of Sn37Pb solder assemblies and Sn3.0Ag0.5Cu solder assemblies subjected to rapid loading.;To evaluate the failure behavior of Sn37Pb and Sn3.0Ag0.5Cu solder assemblies under rapid loading conditions, leadless chip resistors (LCR), ball grid arrays (BGA), small outline integrated circuits (SOIC), and small outline transistors (SOT) were subjected to four point bend tests via a servo-hydraulic testing machine at printed wiring board (PWB) strain rates ≤ 0.1/s. The PWB strain was the metric used to evaluate the failures. The PBGAs and LCRs were examined with both Sn37Pb and Sn3.0Ag0.5Cu solders. There was no significant difference found in the resulting test data for the behavior of the two solder assembly types in the high cycle fatigue regime. PBGA assemblies with both solders were also evaluated at a higher strain rate, approximately 1/s, using drop testing. There was no discernable difference found between the assemblies as well as no difference in the failure rate of the PBGAs at this higher strain rate.;The PWB strain was converted to an equivalent solder stress index using finite element analysis. This equivalent solder stress value was used to compare the results from the LCR and BGA testing for Sn37Pb and Sn3.0Ag0.5Cu. Independently generated BGA data that differed with respect to many testing variables was adjusted and incorporated to this comparison. The resulting plot did not show any significant differences between the behaviors of the two solder assemblies under rapid loading outside of the ultra low cycle fatigue regime, where the assemblies with Sn37Pb solder outperformed the assemblies with SnAgCu solder.
机译：电子电路板在使用过程中会因冲击或振动而承受快速负载；这些事件可能发生在运输，制造或现场条件下。由于无铅迁移，与传统的基于共晶铅的焊料Sn37Pb组件相比，有必要评估这种快速负载如何影响领先的无铅焊料替代品（Sn3.0Ag0.5Cu）组件的耐久性。文献综述表明，Sn37Pb焊料组件和Sn3.0Ag0.5Cu焊料组件在快速加载下的疲劳行为几乎没有共识;评估Sn37Pb和Sn3.0Ag0.5Cu焊料组件在快速加载条件下的失效行为，无引线芯片电阻器（LCR），球栅阵列（BGA），小尺寸集成电路（SOIC）和小尺寸晶体管（SOT）通过伺服液压测试机在印刷线路板（PWB）上进行了四点弯曲测试）应变率≤0.1 / s。 PWB应变是用于评估故障的度量。用Sn37Pb和Sn3.0Ag0.5Cu焊料检查了PBGA和LCR。对于两种焊料组件类型在高循环疲劳状态下的行为，所得测试数据没有显着差异。使用跌落测试，还以较高的应变速率（大约1 / s）评估了两种焊料的PBGA组件。在较高的应变速率下，组件之间没有明显差异，PBGA的故障率也没有差异。使用有限元分析将PWB应变转换为等效的焊料应力指数。将该等效焊接应力值用于比较Sn37Pb和Sn3.0Ag0.5Cu的LCR和BGA测试结果。调整了相对于许多测试变量而言不同的独立生成的BGA数据，并将其合并到此比较中。所得的图没有显示出在超低循环疲劳状态之外的快速负载下两个焊料组件的行为之间没有任何显着差异，其中使用Sn37Pb焊料的组件优于使用SnAgCu焊料的组件。

著录项

  • 作者

    Gregory, Patrice Belnora.;

  • 作者单位

    University of Maryland, College Park.;

  • 授予单位 University of Maryland, College Park.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2010
  • 页码 148 p.
  • 总页数 148
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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