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Antenna design and fabrication using textured ceramic dielectrics.

机译：使用带纹理的陶瓷电介质进行天线设计和制造。

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Antenna miniaturization and bandwidth improvements have always been a challenge for antenna engineers. Antenna miniaturization approaches generally fall into two basic categories, namely, material loading and shape design. However, by and large, material loading has been limited to uniform substrates (from a select set of constants and thicknesses). This is due to the limited availability of material constants and associated fabrication techniques for antenna substrates, particularly non-uniform.; With this in mind, the focus of this dissertation is to introduce antenna designs beyond uniform substrates and superstrates and to consider materials which entail arbitrary dielectric distributions. Such materials are manufactured using novel fabrication techniques and lead to a new class of composites whose properties may not be the same as those of the original constituent components. Such materials are often referred to as metamaterials (meaning "after or beyond materials"), and provide original design possibilities. More specifically, because they allow additional degrees of freedom, they can yield miniaturizations with concurrent bandwidth enhancements that are far beyond those available today.; In this dissertation we explore the potential of metamaterials in antenna design by introducing material modifications in the overall volume of the antenna with particular emphasis on high contrast low loss ceramics developed from a combination of two or more material components. Emphasis is given on UHF antennas since a great need exists in miniaturizing such antennas. Specifically, by looking at various novel metallic and material texture designs, we pursue a design process that achieves larger bandwidth using smaller size aperture than ever before. Among the examples considered are textured substrates for patch antenna designs, and selected implantation of materials in the design of bow-tie and cavity-backed UHF apertures.
机译：天线小型化和带宽改善一直是天线工程师面临的挑战。天线小型化方法通常分为两个基本类别，即材料加载和形状设计。然而，总的来说，材料的负载已被限制在均匀的基板上（从一组选定的常数和厚度中）。这是由于材料常数和天线基板的相关制造技术（特别是不均匀的）的可用性有限。考虑到这一点，本论文的重点是介绍天线设计，使其超出均匀的衬底和覆层，并考虑需要任意介电分布的材料。这种材料是使用新颖的制造技术制造的，并导致了一类新的复合材料，其性质可能与原始组成成分的性质不同。此类材料通常称为超材料（意味着“在材料之后或之后”），并提供了原始的设计可能性。更具体地说，因为它们允许附加的自由度，所以它们可以产生微型化，同时增加带宽，这远远超出了当今的可用范围。在这篇论文中，我们通过在天线的总体积中引入材料修改来探索超材料在天线设计中的潜力，特别着重于由两种或多种材料成分组合而成的高对比度低损耗陶瓷。由于在使此类天线小型化方面存在极大的需求，因此对UHF天线给予了重点。具体来说，通过研究各种新颖的金属和材料纹理设计，我们追求一种设计过程，该过程可以使用比以前更小的孔径来实现更大的带宽。在所考虑的示例中，包括用于贴片天线设计的纹理化基板，以及在领结和背腔式UHF孔设计中选择的材料植入方式。

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