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Predictive failure model for flip chip on board component level assemblies.

机译：板上倒装芯片组件级组件的预测性故障模型。

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摘要

Environmental stress tests, or accelerated life tests, apply stresses to electronic packages that exceed the stress levels experienced in the field. In theory, these elevated stress levels are used to generate the same failure mechanisms that are seen in the field, only at an accelerated rate. The methods of assessing reliability of electronic packages can be classified into two categories: a statistical failure based approach and a physics of failure based approach. This research uses a statistical based methodology to identify the critical factors in reliability performance of a flip chip on board component level assembly and a physics of failure based approach to develop a low cycle strain based fatigue equation for flip chip component level assemblies. The critical factors in determining reliability performance were established via experimental investigation and their influence quantified via regression analysis. This methodology differs from other strain based fatigue approaches because it is not an empirical fit to experimental data; it utilizes regression analysis and least squares to obtain correction factors, or correction functions, and constants for a strain based fatigue equation, where the total inelastic strain is determined analytically. The end product is a general flip chip on board equation rather than one that is specific to a certain test vehicle or material set.
机译：环境压力测试或加速寿命测试会向电子封装施加超过现场压力水平的压力。从理论上讲，这些升高的应力水平仅在加速时才用于产生与现场相同的失效机制。评估电子包装可靠性的方法可分为两类：基于统计故障的方法和基于物理故障的方法。这项研究使用基于统计的方法来确定倒装芯片在元件级组件可靠性性能中的关键因素，并采用基于故障的方法为倒装芯片元件级组件开发基于低周期应变的疲劳方程。通过实验研究确定了确定可靠性性能的关键因素，并通过回归分析量化了它们的影响。这种方法不同于其他基于应变的疲劳方法，因为它不是对实验数据的经验拟合。它利用回归分析和最小二乘法获得校正因子或校正函数，以及基于应变的疲劳方程的常数，其中总非弹性应变是通过解析确定的。最终产品是通用的倒装板上方程式，而不是特定于特定测试车辆或材料集的方程式。

著录项

  • 作者

    Muncy, Jennifer V.;

  • 作者单位

    Georgia Institute of Technology.;

  • 授予单位 Georgia Institute of Technology.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2004
  • 页码 338 p.
  • 总页数 338
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;
  • 关键词

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