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首页> 外文学位 >A thermal simulation of a thin small outline package, using compact components, and a study of effect of change in TXV bulb location on the stability of a refrigeration system.
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A thermal simulation of a thin small outline package, using compact components, and a study of effect of change in TXV bulb location on the stability of a refrigeration system.

机译：使用紧凑的组件对薄的小型外形包装进行热模拟，并研究TXV灯泡位置变化对制冷系统稳定性的影响。

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摘要

In the Part I of the thesis, a detail model of 54 lead Thin Small Outline Package (TSOP) was created in Flotherm and validated against experimental data for natural convection and forced convection environments. Next, a compact two-resistor (2R) model was created in Flotherm using compact smart parts. Values of junction-to-case and junction-to-board resistances were taken from experiments. Both the detailed model and the compact model were mounted on a 4-layered standard JEDEC board for natural convection in a standard JEDEC enclosure.; Part II of the thesis, focuses on IBM's mainframe, which uses a conventional refrigeration system to maintain chip temperatures below that of comparable air-cooled systems, but well above cryogenic temperatures. Attention is given to investigate the characteristics of the thermostatic expansion valve, specifically, the effect of variation of evaporator outlet superheat on the flow through the TXV at varying evaporator temperature and the effect of sudden changes in the evaporator heat load. An expression for the evaporator time constant is developed. The bulb liquid properties are calculated at 75 F and 101.37 psi. (Abstract shortened by UMI.)
机译：在论文的第一部分中，在Flotherm中创建了54引线薄小外形封装（TSOP）的详细模型，并针对自然对流和强制对流环境的实验数据进行了验证。接下来，使用紧凑的智能零件在Flotherm中创建了紧凑的两电阻（2R）模型。结至外壳和结至板的电阻值取自实验。详细模型和紧凑模型都安装在4层标准JEDEC板上，以便在标准JEDEC外壳中自然对流。本文的第二部分重点介绍了IBM的大型机，该大型机使用常规的制冷系统将芯片温度保持在比同类风冷系统低的水平，但仍远高于低温。注意研究恒温膨胀阀的特性，特别是在变化的蒸发器温度下蒸发器出口过热的变化对通过TXV的流量的影响以及蒸发器热负荷突然变化的影响。开发了蒸发器时间常数的表达式。在75 F和101.37 psi下计算灯泡的液体特性。 （摘要由UMI缩短。）

著录项

  • 作者

    Kulkarni, Amit Anil.;

  • 作者单位

    The University of Texas at Arlington.;

  • 授予单位 The University of Texas at Arlington.;
  • 学科 Engineering Mechanical.
  • 学位 M.S.M.E.
  • 年度 2003
  • 页码 81 p.
  • 总页数 81
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;
  • 关键词

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