首页> 外文学位 >Microstructural and chemical study of silicon dioxide/silicon carbide interfaces and correlations with electrical properties of silicon carbide MOS diodes and silicon carbide MOSFETs .
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Microstructural and chemical study of silicon dioxide/silicon carbide interfaces and correlations with electrical properties of silicon carbide MOS diodes and silicon carbide MOSFETs .

机译:二氧化硅/碳化硅界面的微结构和化学研究及其与碳化硅MOS二极管和碳化硅MOSFET的电学性质的关系。

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摘要

Our goals of this study are to understand the possible origins of the low channel mobilities in SiC MOSFETs and the high Dit values at the SiO2/SiC interfaces from a materials science point of view. We use AFM, SEM, TEM (EFTEM and STEM-based EELS) and electrical measurements to characterize the microstructure, chemistry, and electrical properties of the SiO2/SiC interface.; Our observations are briefly summarized as follows. Firstly, we report the observation of carbon clusters at the SiO2/6H-SiC(0001) interfaces as identified by TEM/EELS analyses. The carbon clusters were shown to be products of the thermal oxidation process. Secondly, we report the presence of excess carbon at the interface as a function of oxidation temperatures and re-oxidation conditions. Re-oxidation at 950 C for 3 h significantly reduced, but did not eliminate, the amount of excess interfacial carbon. This observation explain the re-oxidation process lower the Dit values. Thirdly, structural, chemical and electrical analyses were performed on SiC MOSFETs from Purdue University. Wavy SiO2/4H-SiC interfaces are the result of high temperature (1400°C) post ion-implantation annealing. Excess carbons were observed on the MOSFET samples with nitric oxide (NO) annealing. Nitric oxide annealing at 1175°C for 2 h removed excess carbon from the interface.
机译:我们这项研究的目的是从材料科学方面了解SiC MOSFET中低沟道迁移率的可能起源以及SiO 2 / SiC界面处D it 值较高的可能观点看法。我们使用AFM,SEM,TEM(基于EFTEM和STEM的EELS)和电学测量来表征SiO 2 / SiC界面的微观结构,化学性质和电学性质。我们的观察简述如下。首先,我们报告了通过TEM / EELS分析确定的在SiO 2 / 6H-SiC(0001)界面处碳簇的观察。碳簇被证明是热氧化过程的产物。其次,我们报告了界面处过量碳的存在与氧化温度和再氧化条件的关系。在950°C下再氧化3小时可显着减少但没有消除过量界面碳的量。该观察结果解释了再氧化过程降低了Dit值。第三,对普渡大学的SiC MOSFET进行了结构,化学和电学分析。 SiO 2 / 4H-SiC波浪形界面是离子注入退火后高温(1400°C)的结果。使用一氧化氮(NO)退火在MOSFET样品上观察到过多的碳。一氧化氮在1175°C下退火2小时,从界面上去除了多余的碳。

著录项

  • 作者

    Chang, Kai-Chieh.;

  • 作者单位

    Carnegie Mellon University.;

  • 授予单位 Carnegie Mellon University.;
  • 学科 Engineering Materials Science.; Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2003
  • 页码 134 p.
  • 总页数 134
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 工程材料学;无线电电子学、电信技术;
  • 关键词

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