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Numerical and experimental analysis of pellicle-induced distortions of photomasks.

机译：防护膜引起的薄膜变形的数值和实验分析。

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摘要

Meeting the stringent error budget for the insertion of 157 nm lithography for the manufacturing of microcircuit devices in the sub-100 nm regime requires that mask-related distortions be minimized, corrected, or possibly eliminated. Such sources include the pellicle system, which has been previously identified as a potential cause of image placement error. To characterize the many aspects of pellicle-induced distortions, comprehensive finite element (FE) models were developed, and experiments using commercially available soft pellicles (as well as analytical calculations) were used to check the results of the numerical simulations.; The main sources of distortions are: (a) attachment of initially distorted components, (b) temperature variations, (c) gravity-induced refraction effects, (d) chucking in an exposure tool, and (e) dynamic response during exposure scanning. The FE models have accounted for all of these distortion issues in order to define the specifications (or requirements) for pellicle system components to meet the allotted error budgets for 157 nm lithography and beyond.; For the study of soft pellicles, various gasket materials were tested for elastic modulus, the curvatures of reticles and pellicles were measured before and after pelliclization, and image placement data was collected by Intel, in order to benchmark the FE models for the attachment of initially distorted components. The effects of temperature changes were simulated and compared to results experimentally obtained at Intel. In addition, the distortions induced when chucking the reticle/pellicle system in the exposure tool were also quantified.; For the study of hard pellicles, first, gasket materials were tested for elastic modulus, and the effect of purging ports in glass frames was investigated. It was then possible to simulate the effect of temperature changes and the attachment of bowed components. The FE code for the simulation of distortions from hard pellicle refraction was benchmarked against analytical results, and properties and dimensions were varied to optimize the design for static effects. The mounting of the reticle/pellicle system in the exposure tool was simulated, and, finally, the dynamic response of hard pellicles during exposure scanning was studied.
机译：为了在亚100纳米制程中制造微电路器件而满足157 nm光刻技术插入的严格误差预算，要求将与掩模相关的失真最小化，校正或可能消除。这样的来源包括防护膜系统，该防护膜系统先前已被确定为图像放置错误的潜在原因。为了表征薄膜引起的变形的许多方面，开发了综合的有限元（FE）模型，并使用可商购的软薄膜进行实验（以及分析计算）来检查数值模拟的结果。变形的主要来源是：（a）最初变形的零件的附着;（b）温度变化;（c）重力引起的折射效应;（d）曝光工具中的卡盘;以及（e）曝光扫描期间的动态响应。 FE模型考虑了所有这些畸变问题，以便定义防护膜系统组件的规格（或要求），以满足157 nm光刻及以后的分配误差预算。为了研究软薄膜，对各种垫片材料进行了弹性模量测试，并在薄膜化前后测量了标线和薄膜的曲率，并由Intel收集了图像放置数据，以便对最初用于附件的有限元模型进行基准测试组件变形。模拟了温度变化的影响，并将其与英特尔实验获得的结果进行了比较。另外，还量化了当在曝光工具中夹住分划板/薄膜系统时引起的变形。为了研究硬质薄膜，首先，对垫片材料的弹性模量进行了测试，并研究了玻璃框架中吹扫孔的影响。这样就可以模拟温度变化和弓形部件附着的影响。针对硬膜薄膜折射的变形进行仿真的FE代码已根据分析结果进行了基准测试，并且更改了属性和尺寸以优化设计以实现静态效果。模拟了掩模版/防护膜系统在曝光工具中的安装​​，最后研究了硬膜在曝光扫描过程中的动态响应。

著录项

  • 作者

    Cotte, Eric Pierre.;

  • 作者单位

    The University of Wisconsin - Madison.;

  • 授予单位 The University of Wisconsin - Madison.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2001
  • 页码 139 p.
  • 总页数 139
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;
  • 关键词

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