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Pressure sensors on silicon-on-insulator wafers.

机译：绝缘体上硅晶片上的压力传感器。

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摘要

The goal of this project is to develop a vibration sensor for monitoring aircraft vibration in order to flag early structural failures. To precisely evaluate vibration, a pressure sensor is needed because the resonant frequency of a vibration sensor is related to the air pressure affecting it. This dissertation research is focused on determining a technique for improving the quality of pressure sensors. We also investigate their use in biomedical applications.; There are many types of pressure sensors. The piezoresistive type of pressure sensor is the easiest one to integrate with other processes and is also cost efficient. In the past, primarily wet etch has been used to fabricate this type of sensor. However, this technique produces a large back opening even when fabricating only a single device. A new technique using dry etch on silicon-on-insulator wafers is being proposed as a better technique which can reduce the size of back openings and the thickness of the diaphragm. The new technique can heighten device sensitivity and increase the number of pressure sensors that can be fabricated on a small area. This allows the collection of multiple readings from an array of pressure sensors, which will enhance the accuracy and stability of vibration assessments.; We successfully fabricated pressure sensors on bulk silicon wafers when this thesis was written. They were tested both in vacuum chamber for a negative pressure test and on a force station for a positive pressure test. The results show a good linearity over a testing pressure range of 0 to 25 in Hg with respect to 1 atm, which meets the requirements of aircraft structural-health monitoring systems. In future, perhaps the project can be developed further.
机译：该项目的目的是开发一种振动传感器，用于监测飞机的振动，以发现早期的结构故障。为了精确评估振动，需要压力传感器，因为振动传感器的共振频率与影响其的气压有关。本论文的研究重点是确定一种提高压力传感器质量的技术。我们还研究了它们在生物医学应用中的用途。压力传感器的类型很多。压阻式压力传感器是最容易与其他过程集成的传感器，而且具有成本效益。过去，主要使用湿蚀刻来制造这种类型的传感器。然而，即使仅制造单个装置，该技术也会产生较大的后开口。作为一种更好的技术，正在提出一种在绝缘体上硅晶片上使用干法蚀刻的新技术，该技术可以减小后开口的尺寸和膜片的厚度。新技术可以提高设备的灵敏度，并增加可以在小面积上制造的压力传感器的数量。这样可以从压力传感器阵列中收集多个读数，这将提高振动评估的准确性和稳定性。撰写本文时，我们已在大块硅片上成功制造了压力传感器。它们在真空室中进行了负压测试，在受力站中进行了正压测试。结果表明，相对于1个大气压，在0至25英寸汞柱的测试压力范围内，线性良好，符合飞机结构健康监测系统的要求。将来，也许该项目可以进一步发展。

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  • 作者

    Chen, Kuanglun.;

  • 作者单位

    University of Minnesota.;

  • 授予单位 University of Minnesota.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2000
  • 页码 88 p.
  • 总页数 88
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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